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Mobile Test Device Full PCB Manufacturing - Quality PCB Prototyping
Mobile Test Device Full PCB Manufacturing - Quality PCB Prototyping
Production Lead Time:
3 day(s)
Shenzhen Grande Electronic Co Ltd

Shenzhen Grande Electronic Co Ltd

Guangdong, Mainland China

Manufacturer

Average Response Time

N/A

SUPPLIER INFO LAST UPDATED: 19 Nov 2019

ADVERTISE SINCE: 31 Jul 2012

Product Attribute(s)
Colour:
Green
Type of Payment:
T/T
Package:
Yes
Customised:
Yes
Board Thickness:
1.6mm
Min. Line Spacing:
4mils
Min. Line Width:
4mils
Base Material:
FR-4
Copper Thickness:
1OZ
Through Hole Type:
Pin Tthrough Hole PCB
Description
  • Supplier: Shenzhen Grande Electronics
  • Layers: 4
  • Application: Mobile Test Device Full PCB Manufacturing - Quality PCB Prototyping
  • PCB Parameter: FR-4/HTG150
  • Thickness: 1.6mm
  • Surface Treatment: ENIG
  • Testing: 100% E-test
  • Package: Vacuum packing
  • Lead Time: 10-15 days
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Description:
  • PCB Capabilities
  • Layers: 1-30
  • Quantity: 25,000 sq.m/month
  • PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB
  • PCB Basic Material Brand
  • HF: Rogers, Taconic 
  • HTG: S1000-2M, Lianmao IT180A
  • Solder Mask: Taiyo PSR-2000/4000 Series
  • Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated
  • Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger
  • PCB Technical Parameters
  • Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz)
  • Min Via: 0.15mm/0.1mm(Laser)
  • Min Annular Ring: 4mil
  • Max copper thickness: 7oz 
  • Max size: 650x1100mm
  • Thickness Aperture Ratio: 20: 1
  • Tolerance
  • PTH: +/-0.0075mm (min: +/-0.05mm)
  • Outline: +/-0.1mm (min: +/-0.05-0.075mm)

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