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Design Engineering+Electronic Contract Manufacturing
Design Engineering+Electronic Contract Manufacturing
Description
Hardware design:
  • Circuit design.
  • PCB layout.
  • Broad prototype preparation.
  • 3D/2D mechanical design.
  • Mock-up preparation.
  • Working prototype/NPI/EVT/PVT preparation.
  • Packing design.
Software/firmware writing:
  • MCU firmware development.
  • Manufacturing testing program development.
  • Game software development.
  • Android platform application.
Ever Sparkle Technologies Limited
Hong Kong
Manufacturer
Manufacturer
Average Response time:N/A
This label indicates the credibility and capabilities of a supplier in 3 levels: Gold, Silver and Bronze.
SUPPLIER INFO LAST UPDATED: Jul 31, 2017
ADVERTISE SINCE: Jul 31, 2007