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Development of Nano-Activator Doped Surface Modifier
Development of Nano-Activator Doped Surface Modifier
Description

This particular investigation looks into the inter-facial micro-structure and shear strength between with and without nano Ni powder-added Sn-Zn solder and BGA substrates depending on the number of reflow cycles. The AuZn3-based scallop-shaped inter-metallic compound was clearly observed at their interfaces.

  • The addition of nano Ni powder increased the shear strength in Sn-Zn sample due to the formation of fine micro-structure.
City University Of HK - Dept Of Electronic Engineering
HKTDC Exhibitor

City University Of HK - Dept Of Electronic Engineering

Hong Kong

Exporter, Manufacturer

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SUPPLIER INFO LAST UPDATED: 1 Aug 2020

ADVERTISE SINCE: 31 Jul 2007

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