Products’ Features:
 
1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance
projection illumination
 
2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity
between LEDs and MCPCB substrate
 
3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to enable longer lifespan
 
4,  Average efficiency upto 40lm/W @Tj=85℃ with full power