Shenzhen Flying Technology Co Ltd
请输入包含最少两个字元或数字的关键字。
Hdi Multi-Layer PCB Circuit Board
基板材质:
FR-4
铜厚:
18-70um
层数:
4-24
最小孔径:
6mil, 4mil
表面处理:
HASL
板厚:
0.4-3.0mm
描述
联络供应商
描述
- Number of Layers: 4-24 layers
- Order quantity: 1-10000+pcs
- Material: FR-4 and Roger
- Board thickness: 0.4-3.0mm
- Copper Weight: 18-70um
- Min drilling hole diameter: 6mil(0.15mm),4mil(0.10mm)-laser drill
- Surface finish: HASL
您或许喜欢
确定要取消关注此供应商?