Material:
(insulation) heat-shrinkable polyolefin, (solder) lead-free tin, (rings) meltable thermally stabilized thermoplastic.
Solder melting temp: 138℃, flux activated rosin
Work temp: -55℃ TO +125℃
Shrinking temp: >200℃
Dielectric strength: 2Kv
Protection type: IP 67