This is a mobile phone PCB with 6 layers. It is manufactured by professional machines with attention to detail. Professionally engineered, this PCB promises stable and reliable performance.

• 6 layer first-order HDI board Fr4, 1.0mm, and 2oz immersion gold.
• Advantage: short delivery time, affordable and samples.
• Product categories: single/double sided board, multilayer board, and high density board, including MLB with blind/buried via holes.
• Main base material: FR1, FR2, FR4, CEM1, and CEM3.
• High frequency laminate with various dielectric constant (imported or from local supplier), aluminum base laminate, and metal core aluminum board.
• Thickness: inner core thickness: 0.15-1.5mm and finish board thickness: 0.2-3.0mm.
• Copper foil thickness: 1/3-5oz.
• Maximum size: 600 x 1000mm.
• Min. finished board: 5 x 10mm.
• Min. hole size: 0.2mm/8mil.
• Min. line width: 0.1mm/4mil.
• Min. spacing: 0.1mm/4mil.
• Solder mask type: liquid photo imageable solder mask, thermosetting solder mask, and UV solder mask.
• Outline tolerance: ±0.05mm (routing) and ±0.13mm (punching).
• Surface finish: hot air leveling (HAL), electroless Ni/immersion Au, electrical Ni/Au, OSP coating, hard gold plating and immersion tin.
• Rosin inner layer registration tolerance: ±0.05mm.
• Production capacity per day: ≥800m².