• Supplier: Shenzhen Grande Electronics
• Layers: 4
• Application: Mobile Test Device Full PCB Manufacturing - Quality PCB Prototyping
• PCB Parameter: FR-4/HTG150
• Thickness: 1.6mm
• Surface Treatment: ENIG
• Testing: 100% E-test
• Package: Vacuum packing
• Lead Time: 10-15 days
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Description:

• PCB Capabilities
• Layers: 1-30
• Quantity: 25,000 sq.m/month
• PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB
• PCB Basic Material Brand
• HF: Rogers, Taconic 
• HTG: S1000-2M, Lianmao IT180A
• Solder Mask: Taiyo PSR-2000/4000 Series
• Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated
• Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger
• PCB Technical Parameters
• Min trace width/space: outer 4mil, inner 4mil
• Min Via: 0.15mm/0.1mm(Laser)
• Min Annular Ring: 4mil
• Max copper thickness: 1oz 
• Max size: 650x1100mm
• Thickness Aperture Ratio: 20: 1
• Tolerance
• PTH: +/-0.0075mm (min: +/-0.05mm)
• Outline: +/-0.1mm (min: +/-0.05-0.075mm)