Shenzhen Flying Technology Co Ltd
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Multi-Layer Green Prototype Circuit Board
港口:
Shenzhen
板厚:
0.4-2.0mm
基板材质:
FR-4
铜厚:
35-70um
最小孔径:
8mil (0.20mm)
表面处理:
HASL
描述
联络供应商
描述
- Number of Layers: 1-8layers
- Order Quantity: 5-100pcs
- Material: FR-4 Standard Tg 140 degree
- Board Thickness: 0.4-2.0mm
- Copper Weight: 35-70um
- Min Drilling Hole Diameter: 8mil(0.20mm)
- Surface Finish: Lead Free HASL
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