We provide quality multilayer PCBs fulfilling ISO9001 SGS system certification standard and UKAS quality management, achieving the PCB with technical data highlighted below:
Technology: FR4 CEM-1 CEM-3 : Ni/Au, hot air leveling.
More than double-layer: HAL equal electroplating or chemical nickel/gold, hot air leveling (spray-tin), Gold-finger plating, desmear.
The production capacity (double to 10 layers): two-layer 10,000 to 15,000 square meter per month to more than four layers 6,000 to 8,000 square meter per month.
Production lead time:
Single-layer: 3 days.
Double-layer: 5 to 7 days.
Four layers: 7 to 8 days.
More than six-layer: 10 days.
Quality policy: the pursuit of good-quality, zero-defect goal and providing satisfactory service.
Technical data achieved:
Layers: 1 to 10 layers.
Maximum board size: 450 x 600cm 18 x 24 inch.
Minimum board thickness:
4-layer 0.60mm 24mil.
6-layer 1.00mm 40mil.
8-layer 1.20mm 48mil.
10-layer 1.50mm 60mil.
Minimum line width: 0.10mm 4mil.
Minimum space: 0.10mm 4mil.
Minimum hole size: 0.30mm 12mil.
PTH wall thickness: 18um.
PTH hole diameter tolerance: +/-0.10mm 4mil.
Non PTH hole dia. tolerance: +/-0.05mm 2mil.
Hole position deviation: +/-0.05mm 2mil.
Out line tolerance: +/-0.15mm 6mil.
Minimum S/M bridge: +/-0.1mm 4mil.
Twist and bent: less or equal to 1.0%.
Insulation resistance: normal 1m Ohm.
Through hole resistance: less than 300 Ohms normal.