This rigid printed circuit board is designed to support and connect electronic components using conductive pathways. It is manufactured with precise processes and strict quality control. It can increase the manufacturing yield and lower the assembly cost of electrical appliances.

• 1-20 layers.
• Max. panel size: 600 x 550mm.
• FR-4, CEM-1, CEM-3 and others.
• Copper thickness: 1/2-5oz.
• HDI process.
• RoHS and REACH compliant.
• Blind and buried vias.