● Single-sided with 2 to 8 layers
● CEM-3, ceramic substrate, high-Tg, Rogers, and aluminum based board
● Dimension tolerance : ±0.15mm
● Board thickness coverage : 0.3 to 4.0 mm
● Board thickness tolerance : ±15%
● Minimum line width : 0.20 mm
● Minimum line space : 0.20 mm
● Outer layer copper thickness : 12 to 70µm
● Inner layer copper thickness : 12 to 70µm
● Drilling hole diameter : 0.3 to 6.00 mm
● Finished hole diameter : 0.25 to 6.00 mm
● Laser drill hole size : 0.15 mm
● Board thickness and hole diameter ratio : 12 : 1
● Insulation resistance : 10 Kohm - 20 Mohm
● Certification : SO 14001:2004, TS 16949, ROHS COMPLIANT, UL Registered
● OEM accepted