AlphaPro Technology (Hong Kong) Limited

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UV CURABLE WAFER DICING TAPE

美元 $7.20 - 美元 $9.00

美元 $8.00 - 美元 $10.00

生产所需时间:

15 日

运送方式:

Multimodal Transport

品牌:

AlphaPro

是否可订造:

可以

型号编号:

8510

尺寸:

Width: 230, 300, 400 ±1.0mm (Standard) 　Length: 100 +2/-0m (Standard)

Feature:

It can be changed in accordance with operational processes. The tape’s strong adhesion secures wafers during dicing and is then reduced by UV irradiation to facilitate pick-up.

描述

证书及文件

联络供应商

Engineered for the semiconductor industry's wafer dicing processes, AlphaPro 8510 is a high - performance UV - releasable dicing tape. It has a composite structure made up of an 80μm PO base material and a 10μm UV adhesive layer, with an overall thickness of 90μm. This tape combines high initial adhesion with UV - triggered release capabilities. Before UV exposure, it offers a peel strength of 550gf/25mm, which firmly secures the wafers. After being irradiated with 300 - 800mj/cm² of UV light from 365nm LED or high - pressure mercury lamps, the peel strength drops sharply to 6gf/25mm. This allows for the chip to be removed without damage, significantly improving the collection efficiency.

Technical Specifications:

Tensile Strength: 25N/15mm (TD) and 35N/15mm (MD)
Elongation at Break: 450% (TD) and 300% (MD)
Release Film Thickness: 38μm, providing a good balance of flexibility and tear - resistance

证明文件

香港贸发局参展商