This automatic X-Ray equipment features an in-line design, which enables defect detection of invisible part of PCB. It allows the automatic inspection of solder bump by using X-ray. This inspection equipment is a helpful and user-friendly addition to your business.

• Automatic X-ray inspection equipment in-line type FX-355.
• Enable the automatic inspection of solder bump of either BGA or CSP by using X-ray.
• This back chip is deleted, it inspects, and the body part is extracted individually.