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电子产品供应商和制造商

Electronics

零件，组件和原材料

elec

搜罗全球顶尖零件，组件和原材料公司提供的零件，组件和原材料资讯。您可在贸发网采购平台即时谘询可靠和专业的产品供应商，以获取详尽的资料及报价。

零件，组件和原材料供应商和制造商

Parts, Components & Raw Materials

迈高达科技有限公司

◆ High-performance: ARM cortex-A17 Quad-core CPU+Mali-T76x GPU and 2GB DDRAM. Capable of playing 4K*2K UHD videos and handling complex interactive operations.
◆High Robustness: Can achieve 7*24 hours unattended.
◆High level of integration: Integrated with gigabit Ethernet, Wi-Fi, Bluetooth, 6W audio amplifier, TF card
reader, IR remote control, HDMI output, LVDS, eDP, microphone,etc. It is greatly simplify the design of
the whole machine.
◆High scalability: 5x USB ,3xSerial ports,2x I2Cports,6xGPIO

Microtech SMT PCBA Solution RK3288W CPU, 4x DDR3, 8G, 16G/32G/64G/128G Optional PCBA Board With LCD 

MTF156FD10A-V1 is a transmissive type color active matrix liquid crystal display(LCD) which uses amorphous thin film transistor(TFT) as switching devices. This product is composed of a TFT LCD panel, 4 drives IC, a PCBA and a LED-backlight unit. The active display area is 15.6 inches diagonally measured and the native resolution is 1920*RGB*1080.Features of this product are listed in the following table. ParameterValueUnitLCD ModeTFT/Transmissive—Color Depth16.7M—Display Resolution1920RGB*1080pixelsModule Size212.3(H)*360.0(W)*5.70(T)(Exclude PC BA)mmActive Area (A.A)193.59(H)*344.16(W)mmPixel ArrangementRGB-stripe—Viewing DirectionALLDisplay ModeNormally BlackLCD Controller/DriverILI6145A—IC Package TypeCOG—InterfaceeDP—Power Supply Voltage3.0-3.6 (Cell 0.9Wmax)VLCM Brightness1000 (Type.)cd/m2Back-lightWhite LED*100PCS    

15.6 inch 1920*1080 TFT LCD Screen 1000Nits Driver IC*4 LED*100 backlight EDP interface Can bring PCBA plus touch screen

7-inch TFT LCD display module supports 800*1280 with LED backlight unit and 31 ItemSpecificationUnitNoteScreen Size7" diagonalDriver Elementa-si TFT active matrix--Pixel Number800 xR.GB.x 1280pixel-Pixel Pitch0.11775(H) x 0.11775 (V)mm-Pixel ArrangementRGB vertical stripe--Display Colors16,777,216 (8bit color depth)color-Transmissive ModeNormally black--Surface TreatmentHard coating (3H), Glare--Luminance, White300Cd/m2Power Consumption1.47 W (Max.) (Panel 0.4 W (Max.), BLU 1.07W (Max.))(1)ItemMin.Typ.Max.UnitNoteModule SizeHorizontal (H)103.3103.5103.7mm⑴Vertical (V)162.02162.22162.42mmThickness (T)2.65 (w/o PCBA) 4.51 (w/ PCBA)mmBezel Area (CF Polarizer)Horizontal97.1597.3597.55mmVertical153.62153.82154.02mmActive AreaHorizontal94.2mmVertical150.72mmWeight--88g  

7-inch TFT LCD display module supports 800*1280 with LED backlight unit and 31

MTR070WS34A-V1 is a TFT dot matrix LCD module. It is composed of a PCBA, color-LCD panel, driver IC, FPC and a backlight unit. The module display area contains 1024x600 pixels. Thisproduct accords with RoHS environmental criterion. ItemContentsUnitNotesLCD TypeTFT TRANSMISSIVE//Viewing directionAll ViewO' ClockIPSPCBA Outside180.00(W)*108.00(H)*13.50(T)mm/LCM Outside Dimensions165.00(W)*100.00(H)*3.50(T)mm/Active Area (WxH)154.21 (W)*85.92(H)mm/Number of Dots1024x600//Driver ICLT7688/Vcc=3.3VColors16.7M//Touch TypeRTP (4 Line)/Vctp=3.3VBacklight Type3*9=27LEDS/White/Vbl=9.2VBacklight Luminance500Cd/m2/Interface TypeTTL UART (TXD/RXD)/4PIN(2.54)Input Voltage5.0V (VDD)V2A  

7.0 inch serial display resistive touch SPI 1024*600 driver IC LT7688 TTL/UART interface 500 brightness

茂林(香港)线路板有限公司

The displayed printed circuit board is made of FR-4 grade material and has a multi-layer design. It has a heavy copper construction and is finished with immersion gold finish. This durable and functional printed circuit board is ideal for power supply and motor driver use. 	 Rigid printed circuit board (PCB). 	 Material: FR-4. 	 Layer: 2 layers / 4 layers. 	 Board thickness: 0.6mm / 0.8mm / 1.0mm. 	 Finishing: immersion gold. 	 Remote control transmission PCB. 	 Heavy copper. 	 Copper thickness: 2oz / 3oz / 4oz. 	 Power supply PCB. 	 Console PCB. 	 Motor driver PCB. 	 Rectangular shape. 	 Durable and functional. 	 Outstanding quality.  

Rigid PCB

The superior-quality PCB sports a 2-layer construction with 3 thicknesses available. Its surface has been finished with OSP Entek, guaranteeing stable electrical conductivity with a long service life. This is an ideal power supply PCB, heavy copper UPS PCB, and battery charger PCB.

&bull; Material: FR-4/ CEM-3.
&bull; Superior quality.
&bull; 2-layer construction.
&bull; Stable electrical conductivity.
&bull; Board thickness: 1.2mm/ 1.6mm/ 2.0mm.
&bull; High Tg: Tg150/ Tg170.
&bull; Finished with OSP Entek on the surface.
&bull; Green solder mask.
&bull; An ideal power supply PCB, heavy copper UPS PCB, and battery charger PCB.&nbsp;

This PCB is made of the FR-4 material for a robust and durable construction. Built with 4 copper layers, this board promises excellent conductivity and reliable long-term performance with its surface well protected with solder mask and immersion gold finish.

&bull; Material: FR-4.
&bull; Multilayer PCB with 4 copper layers.
&bull; Board thickness: 1.2mm/ 1.3mm/ 1.4mm.
&bull; Finishing: Immersion gold.
&bull; Promise excellent conductivity and reliable long-term performance.
&bull; Robust and durable construction.
&bull; Green solder mask.
&bull; HDI PCB.
&bull; Console PCB with impedance control.
&bull; Auto mobile PCB.

The showcased multilayer PCB features 4 conductive layers to achieve a satisfactory performance. It is finely finished with green solder mask and immersion gold. Ultra-flat in construction yet optimal enough on the conductive performance, this PCB is suitable for a board range of applications.

&bull; Material: FR-4
&bull; 4-layer PCB.
&bull; Board thickness: 0.4mm/ 0.6mm/ 0.8mm.
&bull; Finishing: immersion gold.
&bull; Green solder mask.
&bull; Easy to assemble.
&bull; Ultra-flat construction.
&bull; Boast optimal performance.
&bull; Application: HDI PCB, COB PCB, wire bonding PCB, smart watch PCB, 3D PCB, step PCB, and more.

The double-layer built of this PCB comes in a robust rectangular silhouette, showcasing integrated electronic components for efficient connection within your computing devices. Delicate punched holes are further seen at the corners to ease installation.

Features:
&bull; Material: ceramics.
&bull; Robust rectangular silhouette.
&bull; Double-layer built.
&bull; Punched holes at corners to ease installation.
&bull; Integrated with electronic components.
&bull; Ensure efficient connection in machines.
&bull; Excellent piece for a wide range of electronics devices.
&bull; Roger layer: 2.
&bull; Thickness: 0.8/1.0/1.2mm.
&bull; Finishing: immersion tin/immersion silver.

Applications:
&bull; Transmission PCB.
&bull; Receiver PCB.
&bull; High speed transmission PCB.
&bull; Radiation PCB.
&bull; Low loss PCB.

This 2-layer PCB is made of top-quality FR-4 material, flaunting an ultra-flat construction in 0.6mm thick only. The OSP Entek finish preserves the copper from oxidation, guaranteeing superb conductive performance with a long service life.

&bull; Top-quality FR-4 material.
&bull; 2-layer PCB.
&bull; Flat board in 0.6mm thick only.
&bull; Finishing: OSP Entek.
&bull; Solder mask in green.
&bull; Eco-friendly halogen-free PCB.
&bull; Application: motor PCB and push back tooling step motor PCB.

Featuring fine circuitry and active components, this PCB eases power connection and serves as the foundation for a wide range of computing devices. Its resilient double-layering housing further finishes off with flash gold plating to pledge secure applications.

Features:
&bull; Material: FR-4.
&bull; Thin construction.
&bull; Double-layer housing.
&bull; Showcase fine circuitry and active components.
&bull; Ease current flow.
&bull; Pledge secure and long-term applications.
&bull; Serve as the foundation for a wide range of computing devices.
&bull; Layer: 2.
&bull; Thickness: 0.6mm.
&bull; Finishing: flash gold plating.
&bull; Solder mask color: green.

Applications:
&bull; COB PCB.
&bull; Wire bonding PCB.
&bull; Wearable watch PCB.
&bull; Side push PCB.

Showcased is a 4-layer rigid PCB. It features standard green solder mask and thick gold plating, which ensures superb performance and optimal quality with excellent conductivity. It can be widely applied to the power supply, power generator, ATM, and more.

&bull; Material: FR-4/ CEM-3.
&bull; 4-layer design.
&bull; Board thickness: 2.0mm/ 2.4mm.
&bull; High Tg: Tg150/ Tg170.
&bull; Finishing: immersion gold with thick gold plating.
&bull; Green solder mask.
&bull; Application: power generator, ATM, power supply, heavy copper UPS PCB, and more.
&bull; Battery-charged PCB.

This PCB is crafted of durable FR-4 or CEM-3 material, which features double copper layers, green solder mask, and 1.5mm thickness. This PCB can support middle thermal loads for up to 170&deg;C that lets the electronics runs stably in the long term.

&bull; Material: FR-4/ CEM-3.
&bull; 2-layer construction.
&bull; 1.5mm thick.
&bull; High Tg: Tg150&deg;C/ Tg170&deg;C
&bull; Handled with HAL finishing.
&bull; Solder mask in green.
&bull; Allow improved operating stability of electronics.
&bull; Perfect choice for power supply PCB, ATM power supply heavy copper UPS PCB, and battery charger PCB.

This 4-layer PCB features a flat panel construction with the thickness available ranging from 1.2mm to 1.4mm, allowing the devices to be more compact and lighter. The exposed copper circuitry is well protected from oxidation and wear with immersion gold finishing, which promises high frequency with lasting durability.

&bull; Material: FR-4.
&bull; 4-layer flat panel construction.
&bull; Board thickness: 1.2mm/ 1.3mm/ 1.4mm.
&bull; Finishing: immersion gold.
&bull; Green solder mask.
&bull; Promise high frequency with lasting durability.
&bull; Make the devices more compact and lighter.
&bull; Application: HDI PCB, console PCB, impedance control, and automobile PCB.

This rigid PCB comes constructed with a high-strength FR-4 base, multiple copper layers, green solder mask, as well as reliable immersion gold finishing. We offer various choices of the number of conductive layers, copper thickness, and board thickness to fit a board variety of application needs.&nbsp;&nbsp;

&bull; High-strength FR-4 base.
&bull; Multi-layer construction: 4 layers/ 6 layers/ 8 layers/ 10 layers.
&bull; Board thickness: 1.2mm/ 1.3mm/ 1.4mm/ 1.6mm/ 2.0mm/ 3.0mm.
&bull; Copper thickness: 2oz/ 3oz/ 4oz.
&bull; Finishing: immersion gold.
&bull; Solder mask in green.
&bull; Application: planner transformer heavy copper PCB, coil PCB, inductor PCB, and power Supply PCB.

The multi-layer structure of this PCB finishes off with a green soldered mask to prevent oxidation, depicting fine conductive lines, resistors and more for functional use. Its standard rectangular profile further guarantees quick mounting in different computing devices.

Features:
&bull; Material: FR-4.
&bull; Standard rectangular profile.
&bull; Multi-layer design.
&bull; Depict fine conductive lines, resistors and more.
&bull; With soldered mask to prevent oxidation.
&bull; Pledge efficient current flow and connection.
&bull; Guarantee quick mounting.
&bull; Brilliant circuit board for a number of computing devices.
&bull; Layer: 4.
&bull; Thickness: 1.3mm.
&bull; Finishing: immersion gold.
&bull; Solder mask color: green.

Applications:
&bull; HDI PCB.
&bull; Side plating.
&bull; Protect impedance control.
&bull; Automobile PCB.

Often placed inside generators as well as electronics, this PCB provides efficient conductive pathways for current flow, without any visible wires. Its dual-layer FR-4 housing further finishes off with the popular green solder mask coating to boast durability and reliability.

Features:
&bull; Material: FR-4/CEM-3.
&bull; Slim four-side silhouette.
&bull; Dual-layer housing with green solder mask coating.
&bull; Provide conductive pathways for current flow.
&bull; Guarantee durability and reliability.
&bull; Suitable for a wide range of generators and electronics.
&bull; Layer: 2 layers.
&bull; Thickness: 1.5mm.
&bull; Finishing: OSP Entak.
&bull; High Tg: Tg150, Tg170.
&bull; Solder mask color: green.

Applications:
&bull; Power supply PCB.
&bull; Heavy copper UPS PCB.
&bull; Battery charge PCB.

The irregular outline of this PCB is accented with cut-offs and punched holes to ease mounting in various computing devices. It integrates conductive pathways, transistors and capacitors, forming circuits for functional use. The red solder mask finish further promises long-term applications with lasting good looks.

Features:
&bull; Material: FR-4.
&bull; Irregular outline of double layer design.
&bull; Accented with cut-offs and punched holes.
&bull; Integrate conductive pathways, capacitors and more.
&bull; Promise long-term applications.
&bull; Functional piece for electronic and computing devices.
&bull; Layer: 2.
&bull; Thickness: 1.6mm.
&bull; Finishing: HAL.
&bull; Solder mask color: red.

This 2-layer CPB sports higher heat resistance to ensure high reliability. The nicely flat solder mask is treated with HAL finishing, which provides the components with good protection for oxidation and ensures a trouble-free long service life.&nbsp;

&bull; Material: FR-4/ CEM-3.
&bull; 2-layer PCB.
&bull; 1.6mm thickness.
&bull; High Tg: Tg150 &deg;C/ Tg170 &deg;C.
&bull; Green solder mask with HAL finishing.
&bull; Provide good protection for oxidation.
&bull; Ensure a trouble-free long service life.
&bull; Suitable for power supply applications ranging from ATM to battery charger.&nbsp;

零度新材料（香港）有限公司

Thermal Potting Compound is a kind of thermally conductive product, mainly to provide effective thermal management for heat-generating components, and combined with effective adhesive force to connect the components. Thermal Potting Compound is formulated with epoxy resin and thermally conductive silicone medium and provides two functions: to achieve thermal management goals and eliminate mechanical fasteners with limited space. The curing phenomenon is produced by mixing the two materials according to a specific ratio. After being hardened, it can be used to support and protect the mechanical structure to prevent the structure from being affected by the external environment. It can be poured in a large amount by a dispenser like the thermal putty. Thermal Potting Compound creates a firm bond between the component and the heat sink to reduce the need for screws and fasteners. Whether it is for the PCBA solder joints, liquid and laminate medium, the thermally conductive bonding achieves a reliable, long-lasting connection and effective Heat dissipation, relying on automatic application through dispensing or customized filling solutions 

Thermal Potting CompoundTGS400

This rigid PCB is meticulously made of the FR-4 material, sporting a strong construction with exceptional wear resistance. The two-layer conductive structure guarantees high-speed and stable connecting performance for a long service life with the surface covered by the solder mask and immersion gold finishing.

&bull; Material: FR-4.
&bull; 2-layer conductive structure.
&bull; Board Thickness: 1.5mm
&bull; High Tg: Tg150 &deg;C or Tg170 &deg;C.
&bull; Finishing: immersion gold.
&bull; Blue solder mask.
&bull; Strong construction with exceptional wear resistance.
&bull; Guarantee high-speed and stable connecting performance.
&bull; Ensure a long service life.
&bull; Perfect for using as fingerprint scanner PCB and reader PCB.

10.4 inch IPS LCD module 1024*768 TFT LCD screen with LVDS interface MTF104XA15A-V1 is a transmissive type color active matrix liquid crystal display (LCD), which uses amorphous thin film transistor (TFT) as switching devices. This panel has a 10.4 inches diagonally measured active display area with resolution 1024 x 768. This product is composed of a TFT LCD panel, polarizers, driver ICs, FPC and PCBA                                                          ItemDescriptionUnitDisplay Size10.4inchDisplay TypeTransmissive, a-Si-Active Area (HxV)210.432 (H)x 157.824 (V)mmNumber of Dots (HxV)1024 x RGB x 768dotPixel Pitch(HxV)0.2055x0.2055mmColor ArrangementRGB Stripe-Color Numbers256K/16.7M-Outline Dimension (HxVxT)220.53 (H) x 168.02 (V) x 1.04 (D)mmNTSC (CIE1931) (Under C light)60(Typ.)%White Point (x,y) (Under C light)x:0.318,y: 0.366(Typ.)Response TimeW30msViewing Angle (Light On) (R/U/L/D)CRN 10 @ R/L/U/D(80780780780°) (Min.)Surface TreatmentHCContrast Ratio (Light On)1000:1 (Typ)Operation Temperature-30-80℃Storage Temperature-30-80℃InterfaceLVDSWeight100gPanel power consumptionTBDW  

10.4 inch IPS LCD module 1024*768 TFT LCD screen with LVDS interface

15.0 inch LCD screen 1024*768 TFT LCD module 20pin LVDS interface MTF150XA05A-V1 is a 15.0” TFT Liquid Crystal Display IAV module with LED Backlight units and 20 pins LVDS interface. This module supports 1024 x 768 XGA mode and can display 16.2M/262k colors. The PSWG is to establish a set of displays with standard mechanical dimensions and select electricalinterface requirements for an industry standard 15.0” XGA LCD panel and the LED driving device for Backlight is built in PCBA. SpecificationUnitNoteActive Area304.1 (H) x 228.1(V)(15.0H diagonal)mm(1)Bezel Opening Area307.4(H) x 231.3(V)mmDriver Elementa-Si l r l active matrix--Pixel Number1024 x R.G.Bx 768pixel-Pixel Pitch0.297(H) xO.297(W)mm-Pixel ArrangementRGB vertical Stripe--Display Colors16.2M/262Kcolor-Display ModeNormally Black--Surface TreatmentHard Coating (3H), Anti-Glare--Module Power Consumption7.4wMax.  

15.0 inch LCD screen 1024*768 TFT LCD module 20pin LVDS interface

This PCB is a must-have in your electronic devices that connects capacitors, resistors and other active components for effective use. Its robust multi-layer housing depicts several circular accents with etched current pathways and soldered parts of durable create.&nbsp;

Features:
&bull; Material: FR-4.
&bull; Slim housing.
&bull; Robust multi-layer construction.
&bull; Showcase several circular accents with etched current pathways and soldered parts.
&bull; Promise durable use.
&bull; A must-have component in machineries, electronic devices and more.
&bull; Layer: 4-layer.
&bull; Thickness: 0.4mm.
&bull; Finishing: flash gold plating.
&bull; Solder mask color: green.

Applications:
&bull; HDI PCB COB PCB.
&bull; Wire bonding PCB.
&bull; Smart watch PCB.
&bull; Wearable watch PCB.

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