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Development of Nano-Activator Doped Surface Modifier
Development of Nano-Activator Doped Surface Modifier
描述

This particular investigation looks into the inter-facial micro-structure and shear strength between with and without nano Ni powder-added Sn-Zn solder and BGA substrates depending on the number of reflow cycles. The AuZn3-based scallop-shaped inter-metallic compound was clearly observed at their interfaces.

  • The addition of nano Ni powder increased the shear strength in Sn-Zn sample due to the formation of fine micro-structure.
City University Of HK - Dept Of Electronic Engineering
香港贸发局参展商

City University Of HK - Dept Of Electronic Engineering

香港

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供应商资料最后更新: 2020年8月1日

2007年7月31日登录于贸发网

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