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IC Package
IC Package
描述
This national patented IC package is a brand new package type developed by Shenzhen Chippacking Technology Co., Ltd. It brings benefits of energy saving and resource saving from the compact structure to the total industrial chain from the IC manufacturing to the final electronics devices. This IC package also improves the IC performance and the life of electronics devices.
  • Meets the electronics devices’ requirements of lighter and thinner.
  • Currently, some enterprises have used our Qipai8 to package their products, such as battery charger ICs, voice ICs, MCUs, operational amplifiers, power amplifiers, etc.
  • It owns the same shape as DIP8 and the area of it is only 1/3 of that of DIP8.
SHENZHEN CHIPPACKING TECHNOLOGY CO.LTD.

SHENZHEN CHIPPACKING TECHNOLOGY CO.LTD.

中国内地广东省

制造商

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供应商资料最后更新: 2014年8月4日

2012年7月31日登录于贸发网

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