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PCB Assembly with Components Purchasing/SMT/DIP Assembly/Testing
PCB Assembly with Components Purchasing/SMT/DIP Assembly/Testing
描述
PCBA/OEM/ODM manufacturing services:
*Components Procurement
*PCB Assembly (SMT + DIP + programming + testing)
 Process Capability:
 · PCB Max Size : 400*310mm
 · PCB Min Size: 50*50mm
 · PCB Thickness: 0.4~6mm
 · Components Size: 0201-150mm
 · Min Lead Pitch: 0.3mm
 · Min BGA Ball Pitch: 0.4mm
 · Placement Precision: +/- 0.03mm
 · Lines: 8 x SMT Production Lines, 
         2 x DIP product and 2 assembly lines
 · Lead Time: 3 days after received all materials
*Plastic Moulding and Injection

Capability Overview:
*ISO 9001:2008 Certificated
*RoHS & Lead-Free PCB Assembly
*Advanced FUJI SMT Machine
*Flexible Turnkey Service (Components Purchasing/SMT/DIP Assembly/Testing)
*Prototype Building, No MOQ
*Surface Mount, Through Hole, BGA, QFP, QFN
*Programming, AOI Inspection, Function Test
*Housing Assembly, Cable Assembly
*Fast Delivery 
Kenling Electronics Co., Ltd.
香港
出口商, 制造商
出口商, 制造商
平均回覆时间:不适用
此认证显示供应商的信誉及专长,评级分为金、银、铜三级。
供应商资料最后更新: 2019年7月31日
2014年7月31日登录于贸发网