This high-tech machine is designed for advanced pick-and-place and bonding technology. It supports chip mount with the minimum size of 0201 and IC mount with fine pitch in 0.3mm of QFP. The BGA or micro BGA has a diameter of 0.4mm with a 0.8mm pitch or a diameter of 0.3mm ball with 0.5mm pitch CSP.

• Flip Chip Bonding: ACF, C4 and C5 Technology.
• Aluminum wire bonding.