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Development of Nano-Activator Doped Surface Modifier
Development of Nano-Activator Doped Surface Modifier
描述

This particular investigation looks into the inter-facial micro-structure and shear strength between with and without nano Ni powder-added Sn-Zn solder and BGA substrates depending on the number of reflow cycles. The AuZn3-based scallop-shaped inter-metallic compound was clearly observed at their interfaces.

  • The addition of nano Ni powder increased the shear strength in Sn-Zn sample due to the formation of fine micro-structure.
City University Of HK - Dept Of Electronic Engineering
香港貿發局參展商

City University Of HK - Dept Of Electronic Engineering

香港

出口商, 製造商

平均回覆時間

不適用

供應商資料最後更新: 2020年8月1日

2007年7月31日登錄於貿發網

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