HYTERAEMS provides the professional manufacturing services of SMT and assembly for OEM projects from customers.
The products scope covers:
Digital/analog terminals and systems.
Marine communications systems and equipments.
Industrial mobile terminals, optical module and subsystems.
Communication electronic products.
Industrial motherboards and instruments.
Meters and other testing equipments.
The value addition is from HYTERAEMS's management, lean supply chain solution, engineering, well planned and controlled production, training, quality assurance, cost efficiency, services and social responsibilities been shouldered.
HYTERAEMS has professional engineers specialized in structure, electronics, software, etc, with fixture design, assembly process, automated testing and development capabilities of non-standard equipment, also the machining, milling, grinding and a series of processing equipment, HYTERAEMS fabricates the equipments and provide customers with one-station solution.
HYTERAEMS has been equipped with flexible and diverse back-end assembly process capability (veneer processing, module assembly, finished unit assemble, automatic packaging), to be lean manufacturing and six sigma improvement driven, HYTERAEMS designs and manufactures small loading fixtures, develops leading water-proof and explosion-proof technology, providing customers with value-added services.
HYTERAEMS has multi-level automated testing capabilities of veneer, structure, host and system, using its own technology advantages in communication, can also conduct the board-level testing, functional testing and environmental stress screening testing, test software and fixture development and design. HYTERAEMS is capable to provide the testing solutions according to the complexity of the customer's products.
HYTERAEMS, the leader of the SMT manufacturing technology has a number of process and technology innovation and patents, uses failure analysis and reliability engineering laboratory to provide customers with value-added technology services. The proven ability to mount passive components has reached 0201, 01005; active device placement capacity has reached 0.4mm pitch of the CSP, microBGA, QFN, QFP, MCM and other components at producible levels.