PCB assembly,PCBA,SMT,DIP process. Technical requirement: 1) Surface-mounting Technology(SMT) and Through-hole/DIP 2) 0201,0402,0603 size components SMT technology and lead free technology 3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology. 4) UL,CE,FCC,Rohs standard 5) With IPC-610D manufacturing and other international standards. 6) Nitrogen gas reflow soldering technology for SMT. 7) High density interconnected board placement technology capacity.