ABO ELECTRONICS (SHENZHEN) CO LTD

Type of productions: SMT,DIP process ICT test Professional engineering staff to provide technical support OEM services are welcome PCB assembly,PCBA,SMT,DIP assembly Profound knowledge of contract manufacturing services Capable of developing effective production process to ensure high quality. ISO 9001:2008;ISO13485 

PCB Design and Assembly

Microtech Technology Co Ltd

PCB Design Service
Electronic Design Service
Mechanical Design Service

PCB Design Service

We focus on long-term business development and provide reliable and perfect services to customers, besides existing 9 mature production lines (including the SMT, DIP, FAT and other process lines). We plan to increase 8 more SMT lines, 2-4 more DIP lines, 3-4 more final assembly lines step by step. The PCBA annual production capacity will reach to 50KK pieces, and the final assembly annual production capacity will reach to 20KK units. Surface mount technology (SMT).Professional and reliable.

PCBA SMT

Mecca Electronics Co Ltd

PCBA -SMT Lines &amp; Through Hole Assembly -SMT: PCB size up to 534 x 610 mm -Able to handle 0201 chips -AOI   Box Build  -IPC-A-610 Class II Workmanship -Class III soldering available upon request -ICT -Burn in 

Production Line

Aiketon Electronics Ltd

   From ideas to reality, we help our customer to prepare prototype of all scale from PCB only to product sample with minimal quantity requirement.  

Prototyping PCB Assembly

Unitronics Company Limited

We provide our electronic manufacturing services (EMS) to various industries. In PCB Assembly, we utilize most assembly technologies, including Thru-Hole axial/radial assembly and SMT assembly. Our manufacturing stage supports services like small batches (samples), pilot runs, mass production, and logistics management.  PCB Design for Manufacture and Assembly (DFMA)Design for testability (DFT)Quality and TestingLogistics management

Manufacturing Capabilities & Support Services (EMS)

 We offer professional testing services to PCB assembly lines. The AOI service is provided to ensure high-speed, accurate and consistent inspection. Our advanced equipment and dedicated workers can guarantee reliable testing.    AOI, functional testing, and ageing testing available.   Experienced in this field.  

PCB Assembly Testing

SMT Production Lines / SMT production / PCB Assembly - we welcome Box Build and PCB Assembly full turnkey projects, from pure contract manufacturing to ODM. We manufacture products according to customer specifications, approved material and processes. 

SMT Production Lines

ABO Electronics (ShenZhen) Co., Ltd was set up in 2004 and renovated in 2007 and managed by a team of PCBA professionals. We are a manufacturer specialized in PCB assembly and electronics turnkey manufacturing service of SMT, DIP, final assembly, testing, packing and logistics. It mainly focuses on oversea business. We offer the design services of mechanical solutions, electronics solutions, testing solutions and packing solutions for customers according to their requests, and it also offers the warehousing keeping, logistics distributions and value-added services.  

OEM and ODM Service

AOI inspectionAutomated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used because it is a non-contact test method. 

3D Automated Optical Inspection (AOI)

Shenzhen Huachuang hengda Technology,Ltd

The electronics manufacturing services(EMS) we provide cover almost the entire product cycle, from electronic design, prototyping, and PCB assembly, to cable and harness assembly, full system integration, product testing, and supply chain management. Our full-service electronic manufacturing services are characterized by superior quality and fast turnaround times, which enable us to meet the various project needs of our customers. 

Electronic Manufacturing Services

SPI InspectionSolder Paste Inspection (SPI) is an automated 3D optical inspection performed immediately after the solder paste is printed onto the PCB. It precisely measures the volume, height, and alignment of the paste to detect printing defects early. This proactive check prevents soldering issues in subsequent stages, significantly improving production yield and reducing rework. 

3D Solder Paste Inspection (SPI)

   We could provide assembled PCB inspection in optical, functional. aging test is also available upon request.   Aiketon does 100% optical inspection. It is a crucial process to find and identify defects before in-circuit or final testing. The methodology applied includes AOI system and manual inspection.   This is an in-circuit test which is basically designed to detect manufacturing process faults quickly. During the inspection, testing kits are built to simulate the actual working flow but the reaction is simplify into quick, east-detectable signal. We are able to build the kits ourselves based on customer requirement. Customer is also welcome to provide their own.   Temperature and humidity cycling can be designed for accelerated aging of parts, electronics, and other components to help screen out bad samples and reduce premature field failures. It is considered a popular test to measure the reliability of the assembled PCB.  

PCBA Testing

Svi Public Co Ltd

Electronic manufacturing service, start from PCBA to Final Assembly. Factories located in Thailand, Austria, Slovakia and Hungary. 	 Audio 	 Medical 	 Telecommunication 	 Industrial 	 Transportation 	 etc.,  

Electronic Manufacturing Service - Industrial Product

A And P Productions Ltd

we can provide one stop service from OEM and sourcing items under our customer need. please contact us for more information 

 we can provide your own design and OEM project or sourcing business for our customer 

GRG METROLOGY & TEST GROUP CO., LTD.

GRGTEST technical capabilities cover 2.5D and 3D packaged integrated circuits, and it can provide comprehensive technical services such as failure location analysis (FA), wafer-level material and process failure analysis (MA) for various failed components. Service capabilities Component failure analysisPCB, solder joints, board card failure analysisMetal fracture failure analysis

Failure Analysis 

Arvato Digital Services Ltd

 	 Our value adding and innovative Packaging services work from Design to Delivery 	 From Concept to Specifications, Sourcing, Vendor Management, Quality, Compliance 	 We offer packaging development and design service based on clients&rsquo; requirements. We provide feasible study and modifications to meet clients&rsquo; expectations. We also deliver functional prototypes to the client for evaluation within a very short lead time. 	 Services: based on clients&rsquo; concepts/sketches/drawings images. 	 Brainstorm and work with the&nbsp;client&rsquo;s designer. 	 Provide market available solutions. 	 Provide options for design and materials. 	 Adopt use of different materials to distinguishing clients&rsquo; products. 	 Provide rapid prototyping/samples with artwork. 	 Manufacture of packaging, final pack-out, and fulfillment. 	 Provide 3D design and fitting within a very short lead-time.. 	 Provide options for materials and furnishing effects. 	 Prepare all required testing reports and advice. 	 Packaging for household electronics. 	 Packaging includes thermoform technology, paper pulp molding, offset printing, lamination, etc. 	 Premium optical disc packaging for a well-known electronic game client.  

Packaging Development and Design Service

KB Projects Limited

Size: 1289mm (W) x 320mm (L) x 265mm (H) Material: 350gsm Greyboard mounted on corrugated paper / 2mm Greyboard For more information for quotation, please email 

 Paper Top-Shelf Tray Production

Surface Mount Technology Ltd

 This high-tech machine is designed for advanced pick-and-place and bonding technology. It supports chip mount&nbsp;with the minimum size of 0201 and IC mount with fine pitch in 0.3mm of QFP. The BGA or micro BGA has a diameter of 0.4mm with a 0.8mm pitch or a diameter of 0.3mm ball with 0.5mm pitch CSP. 
 
  Flip Chip Bonding: ACF, C4 and C5 Technology. 
  Aluminum wire bonding. 
 

Pick-and-Place and Bonding Technology

Sun Field Label Printing Factory Limited

SUN FIELD has been in the printing and packaging business for 30 years. In recent years, we extended our service and have a division which specialized in product development and production. We work with a diversity of material such as: Metal, Glasses, Stones, Ceramic, Wood Our inhouse engineer can quickly turn you idea into a 3D illustration, prototype and finally an end piece of product that is up to your quality expectation. Together with our packaging production, we can assemble all parts of your products and deliver to you retail ready.  

Product development and sourcing

Advance Label Ltd

Wide selection of over 500 types of materials merchandise from worldwide, we provide the entire spectrum of printing services from design to assembling. It includes following services &amp; products: 	 Offset Printing 	 Letterpress Printing 	 Silk Screen Printing 	 Digital Printing 	 Thermal Printing 	 Laminating 	 Embossing 	 Pre-press 	 Hot Stamping 	 Folding 	 Perforating 	 Binding 	 Varnishing 	 Assembling 	 Die-cutting 	 Ultrasonic Welding 	 Holographic 	 Soft Touch 	 Fluorescent 	 Glow in Dark 	 Glitter 	 Epoxy 	 Metallic 	 Spot Gloss / Matt UV  Product Label and Packaging: 	 Roll Label 	 Multi-Layered Label 	 Toy sticker 	 Extended Instruction Sticker / Booklet 	 Paper &amp; Plastic Box 	 Scratch-off Card with unique number 	 Decal &amp; Tattoo 	 Hang Tag 	 PP/PC/PVC/PET Film 	 UL/CSA Label 	 Blister Card / Sticker 	 Static Cling Vinyl 	 Note Pad 	 Transfer Sticker 	 UV/Water Resistant Sticker 	 Lenticular 	 Stencil 	 Box / Envelope 	 Multi-Layered Coupon Sticker 	 Security Label 	 Puffy Sticker 	 Packaging Card 	 Boarding Pass / Baggage Tag 	 Thermal Label 	 Hot Melt Satin Label 	 Sticky Memo 	 Fragrance Label 	 Serial / Unique No. 	 Barcode 	 QR Code  

Printing Service

Pantene Industrial Co Limited

 	 An Established designer, developer and manufacturer of high quality products and services to its OEM and electronics industrial partners.&nbsp; 	 We have rich experience in EMS manufacturing service including design, engineering solutions and service world&rsquo;s famous brands for years. Also, highly sophisticated vertical integration provides one-stop manufacturing service from product design to mass production.  

OEM/EMS Product Design Service 

Team Tech Development Limited

Tooling Making At Team Tech Development Limited, we specialize in the design and manufacture of a wide variety of high-quality plastic injection moulds. Our tooling solutions cater to injection molding machines with press capacities ranging from 50 tons to 1000 tons, ensuring flexibility and suitability for different project requirements and product complexities.  Our experienced engineering team utilizes the latest CAD/CAM software and advanced manufacturing technologies to guarantee precision and efficiency in every stage of the mould making process, from initial design and prototyping to final testing and validation. We maintain rigorous quality control throughout production, ensuring that every mould meets stringent international standards and exceeds customer expectations in terms of durability, performance, and cycle life.  We offer a comprehensive range of tooling solutions, including: (A) Prototype Tooling – Designed for small volume production runs (1K–10K units), enabling rapid product development and market testing with reduced lead times and costs. (B) Pre-hardened Tooling – Suitable for medium volume production (50K–250K units). These moulds provide a balance of strength and cost-effectiveness, supporting efficient mid-level manufacturing demands. (C) Tooling – Engineered for high-volume manufacturing (250K–1,000K units), utilizing highly durable materials and advanced heat treatment processes to ensure exceptional mould longevity and consistent product quality in mass production. (D) Over-Mould (Two-Color Moulds) – Expertise in multi-material and multi-color injection moulding techniques, allowing for the integration of different materials or colors in a single product to enhance functionality and aesthetics. (E) Hot Tip and Hot Runner Moulds – Application of advanced hot runner technologies to achieve improved injection efficiency, precise temperature control, and minimized material waste, ideally suited for complex or multi-cavity mould designs. (F) Gas Assisted Injection Process and Die-Cast Moulds – Utilizing gas assisted injection moulding and die-casting expertise to produce lightweight, complex, and dimensionally stable parts with excellent surface finishes.  Team Tech Development Limited’s comprehensive tooling capabilities, commitment to innovation, and customer-focused approach make us a trusted partner for clients across diverse industries, delivering high-precision and cost-effective moulding solutions tailored to our customers’ specific needs.   

My Sourcing