Xiamen Bolion Tech Co., Ltd.
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6 Layer Flexible Circuits with Air-Gap Structure
Production Lead Time:
9 day(s)
Min. Line Spacing:
0.1
Min. Line Width:
0.1
Copper Thickness:
0.35
Number of Layers:
6-Layer
Min. Hole Size:
0.15
Surface Finishing:
ENIG
Description
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Description
- Line Width: 0.1 mm
- Line Space: 0.1 mm
- Hole Size: 0.15 mm
- Flex/rigid Board Thickness: 0.35 mm
- Surface Treatment: ENIG
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Xiamen Bolion Tech Co., Ltd.
Chinese Mainland
Certifications
Supplier info last updated: 2 Aug 2020
Advertise since: 1 Feb 2016
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