I-BIT CO LTD
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Automatic X-Ray Equipment
Model No.:
SIX-2000
Description
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Description
Featured is a high speed inspection wafer bump inspection equipment. This equipment is the automatic X-ray equipment that provides void detection of solder bump. The precise and professional design guarantees reliable performance.
- This equipment is the automatic X-ray equipment which provides void detection of solder bump.
- It penetrates by using void (bubble) in the wafer and using X-rays, and the automatic judgment inspection.
- Quality of void more than a standard value.
- Done from the transfer imaging for the diameter of void (area).
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Supplier info last updated: 4 Aug 2013
Advertise since: 1 Aug 2012
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