C5050 provides the leading Chip on Ceramic type of LED technology for high efficiency solidstate lighting solutions. It offers excellent uniformity, flexibility and cost efficiency along with compact size and wide range of color selections. All components are produced by packing highperformance, LED chips and silicon resin with proprietary phosphors.

Features and Benefits
. Ideal for LED lighting application to avoid multi-shadows
. Higher heat conductivity for better thermal management
. Provide variable and innovative array LED layout designs and combinations
. Reduce the initial development cost and time
. High lumen-performance per dollar cost
. Lead free reflow solder compatible with RoHS compliant

Dimensions and Materials
. Dimensions: 3.45 mm x 3.45 mm
. Packages: Ceramics
. Capsulated Resin: Silicone Resin with Silicate Phosphor
. Electrodes: Ag Plating
. Chips: 1 chip packed in a cavity in single cup

Applications
. Solid State Lighting
. Indoor/Outdoor/Decoration
. Signal Light Engine
. Commercial Display
. Industrial Light Engine