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    BONDTEC TECHNOLOGY CO.,LTD.
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    Flexible Printed Circuit
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    Customised:
    Yes
    Min. Line Spacing:
    0.075mm (3mil)
    Min. Line Width:
    0.075mm (3mil)
    Base Material:
    PI, PET
    Copper Thickness:
    18µm/35µm
    Min. Hole Size:
    ø 0.15mm/6mil
    Surface Finishing:
    Gold plating, Immersion Gold, OSP, Immersion Tin and Tin plating
    Description
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    Description
    1. Environment-friendly and Non-toxic
    2. Soft texture
    3. Can be backlight
    4. Better life expectancy

    BONDTEC TECHNOLOGY CO.,LTD.

    BONDTEC TECHNOLOGY CO.,LTD.

    Taiwan

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