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BONDTEC TECHNOLOGY CO.,LTD.
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Flexible Printed Circuit
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Customised:
Yes
Min. Line Spacing:
0.075mm (3mil)
Min. Line Width:
0.075mm (3mil)
Base Material:
PI, PET
Copper Thickness:
18µm/35µm
Min. Hole Size:
ø 0.15mm/6mil
Surface Finishing:
Gold plating, Immersion Gold, OSP, Immersion Tin and Tin plating
Description
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Description
  1. Environment-friendly and Non-toxic
  2. Soft texture
  3. Can be backlight
  4. Better life expectancy

BONDTEC TECHNOLOGY CO.,LTD.

BONDTEC TECHNOLOGY CO.,LTD.

Taiwan

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