Shenzhen Grande Electronic Co Ltd
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Mobile Test Device Full PCB Manufacturing - Quality PCB Prototyping
Type of Payment:
T/T
Package:
Yes
Customised:
Yes
Board Thickness:
1.6mm
Min. Line Spacing:
4mils
Min. Line Width:
4mils
Base Material:
FR-4
Copper Thickness:
1OZ
Through Hole Type:
Pin Tthrough Hole PCB
Description
Contact Supplier
Description
- Supplier: Shenzhen Grande Electronics
- Layers: 4
- Application: Mobile Test Device Full PCB Manufacturing - Quality PCB Prototyping
- PCB Parameter: FR-4/HTG150
- Thickness: 1.6mm
- Surface Treatment: ENIG
- Testing: 100% E-test
- Package: Vacuum packing
- Lead Time: 10-15 days
Description:
- PCB Capabilities
- Layers: 1-30
- Quantity: 25,000 sq.m/month
- PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB
- PCB Basic Material Brand
- HF: Rogers, Taconic
- HTG: S1000-2M, Lianmao IT180A
- Solder Mask: Taiyo PSR-2000/4000 Series
- Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated
- Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger
- PCB Technical Parameters
- Min trace width/space: outer 4mil, inner 4mil
- Min Via: 0.15mm/0.1mm(Laser)
- Min Annular Ring: 4mil
- Max copper thickness: 1oz
- Max size: 650x1100mm
- Thickness Aperture Ratio: 20: 1
- Tolerance
- PTH: +/-0.0075mm (min: +/-0.05mm)
- Outline: +/-0.1mm (min: +/-0.05-0.075mm)
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Supplier info last updated: 19 Nov 2019
Advertise since: 1 Aug 2012
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