This multi-layer lapping metalized ceramic substrate is widely used in many applications including HIC chips, network resistances, focalized potentiometers, semiconductor congealers, power modules, etc. The quality substrate is heat conductive and temperature resistant. The reliable substrate is durable and requires little maintenance.

• The introduction of tape casting process.
• The introduction of laser punching machine.
• The introduction of the automation printing machines, which help to print the surface of ceramics automatically.
• The introduction of molybdenum wire furnace.
• All products can be sintered in the hydrogen atmosphere.