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Parason Industries Ltd
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Multilayer PCB with Immersion Silver Finished , Manufacturing Standard: IPC-A-600F and PERFAG
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Description
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Description
  • Double-sides and multilayer (up to 16-Layer)
  • Base material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger
  • Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printingm Peelable Blue Mask (peters2954)
  • Solder Mask: Taito PSR 4000, Taimura DS2200, Electra (Dull Green)
  • Technology: Blind Vias, Buried Visa, Micro Visa, Selective Plating, HDL, Leadfree
  • Maximum Panel Size: 20〃 x 24〃 (508 x 610mm)
  • Minimum Hole Diameter 0.008〃 (0.2mm)
  • Finished Hole Tolerance: ∮0.002〃 (∮0.05mm)
  • Minimum Line Width / Spacing: 0.004〃/ 0.004" (0.10/0.10mm)
  • Board Thickness: 0.016〃 (0.40mm) for 4-Layer, 0.020〃 (0.60mm) for 6-Layer

Parason Industries Ltd

Parason Industries Ltd

Hong Kong

Exporter, Manufacturer

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