This product is a printed circuit board for the communication sector, applicable to 5G base stations, optical modules, switches, RF antennas, communication backplanes and other equipment. Multi-layer construction is available, with optional high Tg FR-4, Rogers, Arlon and other high-frequency substrates. Impedance control is implemented to ensure high-speed signal transmission, featuring stable dielectric constant, low dielectric loss and excellent signal integrity. Mechanical through holes, blind and buried vias are available to support fine line width and space design. Surface finishes include lead-free HASL, immersion gold, immersion silver and OSP. It delivers good heat resistance and stable EMC performance, meeting strict reliability requirements of communication equipment. Customized production is supported.