We provide quality multilayer PCBs fulfilling ISO9001 SGS system certification standard and UKAS quality management, achieving the PCB with technical data highlighted below:

• Technology: FR4 CEM-1 CEM-3 : Ni/Au, hot air leveling.
• More than double-layer: HAL equal electroplating or chemical nickel/gold, hot air leveling (spray-tin), Gold-finger plating, desmear.
• The production capacity (double to 10 layers): two-layer 10,000 to 15,000 square meter per month to more than four layers 6,000 to 8,000 square meter per month.

Production lead time:

• Single-layer: 3 days.
• Double-layer: 5 to 7 days.
• Four layers: 7 to 8 days.
• More than six-layer: 10 days.
• Quality policy: the pursuit of good-quality, zero-defect goal and providing satisfactory service.

Technical data achieved:

• Layers: 1 to 10 layers.
• Maximum board size: 450 x 600cm 18 x 24 inch.

Minimum board thickness:

• 4-layer 0.60mm 24mil.
• 6-layer 1.00mm 40mil.
• 8-layer 1.20mm 48mil.
• 10-layer 1.50mm 60mil.
• Minimum line width: 0.10mm 4mil.
• Minimum space: 0.10mm 4mil.
• Minimum hole size: 0.30mm 12mil.
• PTH wall thickness: 18um.
• PTH hole diameter tolerance: +/-0.10mm 4mil.
• Non PTH hole dia. tolerance: +/-0.05mm 2mil.
• Hole position deviation: +/-0.05mm 2mil.
• Out line tolerance: +/-0.15mm 6mil.
• Minimum S/M bridge: +/-0.1mm 4mil.
• Twist and bent: less or equal to 1.0%.
• Insulation resistance: normal 1m Ohm.
• Through hole resistance: less than 300 Ohms normal.
• Electric strength: greater than 1.3KV per mm.
• Current breakdown: 10A.
• Peel strength: 1.4N per mm.
• Solder mask abrasion: greater than 4H.
• Flammability: 94V-0.
• Test voltage: 50 to 300V.