SER series reflow oven adopts advanced technology and inspection standard of IPC-985X (evaluation of reflow oven), which fully satisfy the temperature profile requirement of IPC-7530 (Guidelines for Temperature Profiling for Mass Soldering Processes) and IPC/JEDEC J-STD-020C(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices), providing powerful equipment and technology guarantee for production and processing, and the most valuable product and service for enterprises.

Technical Parameter:

• Cooling Type: Air Cooling
• Temp. Accuracy: Emhanced P.I.D.Control
• Reiteration Accuracy: Under continual production, the difference of temperature on different board is±1℃
• Machine Reiteration: Under the same technics parameter setting, the reiteration of temperature profile on different stages is ±1℃
• PCB Temp Deviation: ±1℃

SER series included

• 6, 8, 10, 12 heating zone
• Nitrogen (option)
• Air or water cooling (option)