(1)Semiconductor chip test probe Top Plunger& Bottom Plunger

Pd Alloy： Top plunger,Bottom plunger

BeCu： Top plunger,Bottom plunger

SK4： Top plunger,Bottom plunger

(2)Manufacturing Technology

Compound cutting with high precision CNC automatic lathe.

Heat treatment.

Manufacture of bars and coils of palladium alloys, etc.

Surface finishing.

(3)Special Processing Technology

Ultra-micro machining capability:part OD＞0.02mm.

Micro compound cutting,front and rear end processing.

Micro hole machining,hole ID＞0.10mm.

Mirror surface processing on probe head.

Precision metal alloy drawing,straightening and cutting.