Parason Industries Ltd
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Six-Layer PCBs with Entek + Hard-Gold Plated Contact Finger, Standard: IPC-A-600F and PERFAG
Description
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Description
- Double-sided and multilayer (up to 16-Layer)
- Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger
- Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask (peters 2954)
- Solder Mask: Taiyo PSR4000, Taimura DSR2200, Electra (Dull Green)
- Technology: Blind Vias, Buried Vias, Selective Plating, Micro Vias (Laser Drll)
- Maximum Panel Size: 20" x 24" (508 x 610mm)
- Minimum Hole Diameter: 0.008" (0.2mm)
- Finished Hole Tolerance: +-0.002" (+-0.05mm)
- Minimum Line Width/ Spacing: 0.004"/ 0.004" (0.10/0.10mm)
- Board Thickness: 0.016" (0.40mm) for 4-Layer, 0.020" (0.60mm) for 6-Layer
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Supplier info last updated: 30 Sep 2020
Advertise since: 1 Sep 2003
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