The wire wound chip inductor features a miniature SMD chip for fully automated assembly. It comes with outstanding endurance from pull-up force, mechanical shock and pressure. This wire would chip inductor is suitable for RF products and broadband applications including cellular phones, cordless phones, remote controls, wireless PDAs, cable modems, etc.

• Ceramic base.
• Tighter tolerance down to +/- 2%.
• Low profile and high current are available.