I-BIT CO LTD
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X-Ray Automatic Inspection Equipment
Model No.:
FX-355
Description
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Description
This automatic X-Ray equipment features an in-line design, which enables defect detection of invisible part of PCB. It allows the automatic inspection of solder bump by using X-ray. This inspection equipment is a helpful and user-friendly addition to your business.
- Automatic X-ray inspection equipment in-line type FX-355.
- Enable the automatic inspection of solder bump of either BGA or CSP by using X-ray.
- This back chip is deleted, it inspects, and the body part is extracted individually.
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Supplier info last updated: 4 Aug 2013
Advertise since: 1 Aug 2012
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