Evergreen (H.K.) PCB Limited

   Single Layer, Double Layer, Mulit Layer as 4 to 12 Layer, Aluminum Board also available.   Entek Coating, Immersion Gold, Immersion Silver, Flash Gold Plating, Hot Air Solder Leveling.  

Single Layer to 12 Layer & Aluminum Board

ShenZhen Lepower Opto Electronics Company Limited

POWER:1W-5W.High thermal conductivity ceramic holder, low thermal resistance and better heat dissipation.Surface mount technology, high reliability, strong seismic resistance, low solder joint defect rate.Uniform brightness, superior light color consistency, more suitable for landscape and stage lighting.The half-power of 140° viewing angle for a Wider illumination.Sealed moisture-proof,anti-static aluminum foil packaging, meets the environmentally friendly lead-free process requirements.4 in 1 RGBW LEDs,Among them, white light can be customized 3000K4000 K6000K etc.

3535/5050-RGBW

Kopen Electrical Co Ltd

Durable and functional, this solder wire dispenser stand can position up to 1 kg solder wire bobbin and assures the solder to go neatly unwinded when being threaded through the loop. Boasting masterful workmanship, the spindle mantles and dismantles smoothly and rotates flexibly for effortless operation. 
 
• Come in three versions. 
• Able to accommodate up to 1 kg solder wire bobbin. 
• The solder neatly unwinds when it is threaded. 
• Constructed with a secure handle for easy carry. 
• A great soldering necessity of any user's workbench 
• KP-281 basic solder wire dispenser stand. 
• KP-282 basic version + additional tip cleaning sponge. 
• KP-283 3-in-1 stand with tip cleaning sponge and soldering iron stand. 
• Self-assembly parts in compact hanging color box.

Solder Wire Dispenser Stand

Jung Shing Wire Co.,ltd

Ribbon Wire : A magnet wire with a flat conductor. JSW manufactures various kinds of ribbon wires specifically for miniaturization without loss of performance. 

Copper-Clad Aluminum Wire The enameled copper-clad aluminum wire has a composite conductor made of aluminum clad with copper. It possesses not only lightness in weight as aluminum but also contains solder ability and corrosion resistance as copper.
   Material: Copper, Aluminum, Copper-clad aluminum, Copper-Clad Steel.   HS Code: 8544.11.00.00-4.   Color: natural.   Please contact sales: hsin5715@nt1.jswire.com.tw for minimum quantity.   Size: 0.15~0.8mm,&nbsp;CAW: 0.07~0.8mm or ribbon: 0.11~1.3mm.   Certification related to product: UL, ISO or SGS.  

Special Wire 

Glorysky Electronics Co Ltd

The single-sided PCB is made of sturdy aluminum to withstand long service. It is finished with a white solder mask which reduces solder bridging and electrical shorts. The mask also does a good job in protecting circuitry from handling damage, dirt and fingerprints.
 
  Easy to install and maintain. 
  Assorted models for selection. 
 

Aluminum PCB

GRANDWORK ELECTRONICS INDUSTRY COMPANY LIMITED

 This is a collection of LED lighting PCBs with super white solder mask coating. Featuring an immersion gold finish, these PCBs are durable and efficient. These high quality PCBs are suitable for various LED lighting products. 
 
  MC PCB&nbsp;and&nbsp;aluminum lighting PCB. 
  With super white solder mask coating. 
  MC PCB for LED ceiling lamps,&nbsp;LED desk lamps,&nbsp;LED lamps,&nbsp;office lighting and&nbsp;different kinds of LED lighting products. 
  Copper: 1oz, 2oz or 3oz. 
  Surface finishing: HASL LF. 
  Immersion gold. 
 

LED Lighting PCB

This is a mobile phone PCB with 6 layers. It is manufactured by professional machines with attention to detail. Professionally engineered, this PCB promises stable and reliable performance.
 
  6 layer first-order HDI board Fr4, 1.0mm, and 2oz immersion gold. 
  Advantage: short delivery time, affordable and samples. 
  Product categories: single/double sided board, multilayer board, and high density board, including MLB with blind/buried via holes. 
  Main base material: FR1, FR2, FR4, CEM1, and CEM3. 
  High frequency laminate with various dielectric constant (imported or from local supplier), aluminum base laminate, and metal core aluminum board. 
  Thickness: inner core thickness: 0.15-1.5mm and finish board thickness: 0.2-3.0mm. 
  Copper foil thickness: 1/3-5oz. 
  Maximum size: 600 x 1000mm. 
  Min. finished board: 5 x 10mm. 
  Min. hole size: 0.2mm/8mil. 
  Min. line width: 0.1mm/4mil. 
  Min. spacing: 0.1mm/4mil. 
  Solder mask type: liquid photo imageable solder mask, thermosetting solder mask, and UV solder mask. 
  Outline tolerance: &plusmn;0.05mm (routing) and &plusmn;0.13mm (punching). 
  Surface finish: hot air leveling (HAL), electroless Ni/immersion Au, electrical Ni/Au, OSP coating, hard gold plating and immersion tin. 
  Rosin inner layer registration tolerance: &plusmn;0.05mm. 
  Production capacity per day: &ge;800m 2 . 
 

Mobile Phone PCB

Shenzhen Lianchuang Electronics Co. Ltd

This special PCB is meticulously crafted with excellent craftsmanship. It is also manufactured under strict QC for reliable quality. The refined PCB makes an essential component for various electrical devices.
 
  Material: aluminum, PTEE, high TG and Rogers. 
  Galvanic-hard gold up to 40U 
  Various finishes, solder masks and silk screens. 
 

Printed Circuit Board

Hitek Technology Co., Ltd

This is a single-sided printed circuit board. The PCB can be applied to a variety of electronic products. Carefully equipped, this PCB guarantees high performance and great durability.&nbsp;
 
  Material: aluminum. 
  Thickness: 1.6mm. 
  Layer: 1 (single-sided board). 
  Copper thickness: 1oz. 
  Solder mask: white. 
  Silkscreen: black. 
  Surface finish: ENIG, 2-5u&quot;. 
  Peelable mask: none. 
  Impedance control. 
  X-out: none. 
  Press fit: none. 
  Via in pad. 
 

Aluminum Printed Circuit Board

MECS TECH CO.,LTD.

This ultrasonic soldering iron is able to solder a variety of materials such as aluminum, ceramic, nickel, titanium and glass. It comes with a non-slip, heat-resistant handle for a secure and comfortable grip. This soldering iron is widely used for soldering ribbon on the solar cell glass (ITO glass).
   Long life span.   Easy to operate.   Video files on Youtube
  Soldering copper wire on Glass by Ultrasonic Soldering Iron 
http://youtu.be/ZLzrdCzeM5g

 Soldering ITO Glass by Ultrasonic Soldering Iron  
http://youtu.be/cADRB3RimrU

 Ultrasonically Soldering Aluminum plate and Glass 
http://youtu.be/wuB1zxn0tl0

 Ultrasonically Soldering on Rear side of Solar Cell Wafer 
http://youtu.be/rk5cOEoend0

 Soldering copper wire on Glass by using Ultrasonic Soldering Iron 
http://youtu.be/NpJ8T8JWMMw

 Soldering Aluminum Plate by using Ultrasonic Soldering Machine 
http://youtu.be/YvORjT6Rfo4 

 Other ultrasonic applications of MECSTECH 
http://www.youtube.com/user/mecstech
  

Ultrasonic Soldering Iron

Zhejiang Baichuan Conductor Technology Co.,Ltd

 	 General use mild steel solid MIG wire with manganese and silicon 	 Every Package comes with Material Certification 	 Applications: Structural steel. Medium to heavy mill scale base material.  

Copper- Clad Steel Wire 

Shenzhen Leadsin. Technology Co., Ltd.

 	 Smart Home Multi Layer PCB Board Assembly Service 	 PCB&nbsp;and&nbsp;PCBA&nbsp;specification 	 Plate: FR4, High TG FR4, the high CTI FR4, high-frequency material, halogen-free materials, aluminum materials 	 Layers :2-20 layer 	 Finished copper thickness :0.5-5 OZ 	 Finished thickness :0.2-6 .0 mm 	 Minimum line width: 3mil 	 Minimum line spacing: 3mil 	 Minimum Outline Tolerance: + /-0.1mm 	 Minimum finished hole: 0.1mm 	 Maximum Aspect Ratio: 12:1 	 The smallest solder mask bridge width: 4mil 	 Minimum character line width: 5mil 	 Minimum character height: 30mil 	 Solder mask color: green, black, blue, white, yellow, purple, etc. 	 The characters colors: white, yellow, black, etc. 	 Surface technology: HASL, HASL, Immersion Gold, plating Shuijin, OSP, Immersion Tin, Immersion silver 	 Other process: Goldfinger, blue plastic, blind and buried vias, characteristic impedance control, flex 	 Reliability test: open / short circuit test, impedance test, solderability testing, thermal shock testing, metallographic micro-slice analysis 	 Winged curvature: &le; 0.7% 	 Flammability class: 94V-0  

Smart Home Multi Layer PCB Assembly Service

 	 Integrated Circuits PCB Assembly OEM ODM welcome 	 PCB and PCBA specification 	 Plate: FR4, High TG FR4, the high CTI FR4, high-frequency material, halogen-free materials, aluminum materials 	 Layers :2-20 layer 	 Finished copper thickness :0.5-5 OZ 	 Finished thickness :0.2-6 .0 mm 	 Minimum line width: 3mil 	 Minimum line spacing: 3mil 	 Minimum Outline Tolerance: + /-0.1mm 	 Minimum finished hole: 0.1mm 	 Maximum Aspect Ratio: 12:1 	 The smallest solder mask bridge width: 4mil 	 Minimum character line width: 5mil 	 Minimum character height: 30mil 	 Solder mask color: green, black, blue, white, yellow, purple, etc. 	 The characters colors: white, yellow, black, etc. 	 Surface technology: HASL, HASL, Immersion Gold, plating Shuijin, OSP, Immersion Tin, Immersion silver 	 Other process: Goldfinger, blue plastic, blind and buried vias, characteristic impedance control, flex 	 Reliability test: open / short circuit test, impedance test, solderability testing, thermal shock testing, metallographic micro-slice analysis 	 Winged curvature: &le; 0.7% 	 Flammability class: 94V-0  

Integrated Circuits PCB Assembly

This ultrasonic soldering machine is great for soldering a variety of materials such as aluminum, ceramic, nickel and titanium.&nbsp;Equipped with the advanced ultrasonic vibration technology, the machine can greatly reduce the rate of detective products. Without flux-cleaning process, the machine will not cause any corrosion to the metal.   Cost savings is achieved by enabling replacement of expensive copper wire by aluminum wire.   Reduction in equipment cost and production cost due to none necessity of process related with flux.   Reduction in proportion of defective joints due to no-corrosion caused by flux.&nbsp;   Vibration energy enables solder to penetrate into a very fine space so that perfect soldering is achieved.&nbsp;   Successful soldering of glass, ceramic and hard-solder-materials that is known as impossible to be soldered in conventional soldering method.   Apply to solar cell glass, semiconductor, ceramic heater, soldering of different material (Al-Cu, Al-Glass, Al-Ceramic).&nbsp;   Eco-friendly soldering solution.   No need any harmful chemicals to environment and human body because flux and flux-cleaning process are not needed.   There is no water and air pollution in work place because flux and flux-cleaning process are not needed.   Video files on Youtube 
 Soldering aluminum wire using ultrasonic ( No flux )  
http://www.youtube.com/watch?v=fFZwKNHnCnc&amp;NR=1

 Flux free soldering of copper stick using ultrasonic soldering pot  
http://www.youtube.com/watch?v=yH46d5vdkx4

 Ultrasonic Bonding Machine for Sputtering Target 
http://www.youtube.com/watch?v=I_4BiBGG8dE

 Soldering copper wire on Glass by Ultrasonic Soldering Iron 
http://youtu.be/ZLzrdCzeM5g

 Soldering Aluminum Plate by using Ultrasonic Soldering Machine  
http://youtu.be/YvORjT6Rfo4

 Other ultrasonic applications of MECSTECH 
http://www.youtube.com/user/mecstech
  

Ultrasonic Soldering Machine

Schlenk Metallfolien GmbH & Co KG

This is a series of metal foil rolls that we produce. The metal foils are of different metals, thicknesses and widths. They can be used in many industries from batteries making, cable shielding, EMI shielding, heating foils, lamination, heat exchanges, transformers, fuses, solar cells, PCB, FFC and FFCL.
    Available in metals of copper, nickel, silver in various purity levels  Available in alloys of nickel-silver and copper series (brass, bronze, copper-nickel)  Available in foil thicknesses between 6 to 500 microns  Available in foil width between 1mm to 650mm  Additional upgrades for surface plated foils with tin, aluminum, silver, nickel and tin-solder  Additional upgrades for strip finishing treatments  Metal foils usually comes in rolls with paper carton centers  

Metal Foil Rolls

This is a series of metal sheet rolls that we produce. The metal sheets are of different metals, thicknesses and widths. They can be used in many industries from batteries making, cable shielding, EMI shielding, heating foils, lamination, heat exchanges, transformers, fuses, solar cells, PCB, FFC and FFCL. 
   Available in metals of copper, nickel, silver in various purity levels   Available in alloys of nickel-silver and copper series (brass, bronze, copper-nickel)   Available in foil thicknesses between 6 to 500 microns   Available in foil width between 1mm to 650mm   Additional upgrades for surface plated foils with tin, aluminum, silver, nickel and tin-solder   Additional upgrades for strip finishing treatments   Metal sheets usually comes in rolls with paper carton centers  

Metal Sheet Rolls

Parason Industries Ltd

  Double-sides and multilayer (up to 16-Layer)  Base material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger  Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printingm Peelable Blue Mask (peters2954)  Solder Mask: Taito PSR 4000, Taimura DS2200, Electra (Dull Green)  Technology: Blind Vias, Buried Visa, Micro Visa, Selective Plating, HDL, Leadfree  Maximum Panel Size: 20〃 x 24〃 (508 x 610mm)  Minimum Line Width / Spacing: 0.004〃 (0.10/0.10mm)  Finished Hole Tolerance: ∮0.002〃 (∮0.05mm)  Minimum Line Width / Spacing: 0.004〃 (0.10/0.10mm)  Board Thickness: 0.016〃 (0.40mm) for 4-Layer, 0.020〃 (0.60mm) for 6-Layer.  

8 - Layer  PCB,0.8 mm Thickness, Microvias and controlled impedance PCB

  Double-sides and multilayer (up to 16-Layer)  Base material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger  Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printingm Peelable Blue Mask (peters2954)  Solder Mask: Taito PSR 4000, Taimura DS2200, Electra (Dull Green)  Technology: Blind Vias, Buried Visa, Micro Visa, Selective Plating, HDL, Leadfree  Maximum Panel Size: 20〃 x 24〃 (508 x 610mm)  Minimum Hole Diameter 0.008〃 (0.2mm)  Finished Hole Tolerance: ∮0.002〃 (∮0.05mm)  Minimum Line Width / Spacing: 0.004〃/ 0.004&quot; (0.10/0.10mm)  Board Thickness: 0.016〃 (0.40mm) for 4-Layer, 0.020〃 (0.60mm) for 6-Layer  

Multilayer PCB with Immersion Silver Finished , Manufacturing Standard: IPC-A-600F and PERFAG

   Double-sides and multilayer (up to 16-Layer)   Base material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger   Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printingm Peelable Blue Mask (peters2954)   Solder Mask: Taito PSR 4000, Taimura DS2200, Electra (Dull Green)   Technology: Blind Vias, Buried Visa, Micro Visa, Selective Plating, HDL, Leadfree   Maximum Panel Size: 20〃 x 24〃 (508 x 610mm)   Minimum Hole Diameter 0.008〃 (0.2mm)   Finished Hole Tolerance: ∮0.002〃 (∮0.05mm)   Minimum Line Width / Spacing: 0.004〃/ 0.004&quot; (0.10/0.10mm)   Board Thickness: 0.016〃 (0.40mm) for 4-Layer, 0.020〃 (0.60mm) for 6-Layer  

Multilayer PCB with Immersion Tin Finish, Manufacturing Standard: IPC-A-600F and PERFAG

   Double-sided and multilayer (up to 16-Layer)   Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, roger   Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask (Peters 2954)   Solder Mask: Taito PSR 4000, Taimura DS2200, Electra (Dull Green)   Technology: Blind Vias, Buried Visa, Micro Visa, Selective Plating, HDL, Leadfrer   Maximum Panel Size: 20〃 x 24〃 (508 x 610mm)   Minimum Hole Diameter: 0.008〃 (0.2mm)   Finished Hole Tolerance: ∮0.002〃 (∮0.05mm)   Minimum Line Width / Spacing: 0.004&quot;/ 0.004&quot; (0.10/0.10mm).   Board Thickness: 0.016〃 (0.40mm) for 4-Layer, 0.020〃 (0.60mm) for 6-Layer  

14-Layer PCB with Immersion Gold Finish, Thickness: 1.6mm, Standard: IPC-A-600F and PERFA

   Double-sided and multilayer (up to 16-Layer)   Base Material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger   Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask (peters 2954)   Solder Mask: Taiyo PSR4000, Taimura DSR2200, Electra (Dull Green)   Technology: Blind Vias, Buried Vias, Selective Plating, Micro Vias (Laser Drll)   Maximum Panel Size: 20&quot; x 24&quot; (508 x 610mm)   Minimum Hole Diameter: 0.008&quot; (0.2mm)   Finished Hole Tolerance: +-0.002&quot; (+-0.05mm)   Minimum Line Width/ Spacing: 0.004&quot;/ 0.004&quot; (0.10/0.10mm)   Board Thickness: 0.016&quot; (0.40mm) for 4-Layer, 0.020&quot; (0.60mm) for 6-Layer  

My Sourcing

Unfollow this supplier?

Unfollow this supplier?