This national patented IC package is a brand new package type developed by Shenzhen Chippacking Technology Co., Ltd. It brings benefits of energy saving and resource saving from the compact structure to the total industrial chain from the IC manufacturing to the final electronics devices. This IC package also improves the IC performance and the life of electronics devices.
Meets the electronics devices’ requirements of lighter and thinner.
Currently, some enterprises have used our Qipai8 to package their products, such as battery charger ICs, voice ICs, MCUs, operational amplifiers, power amplifiers, etc.
It owns the same shape as DIP8 and the area of it is only 1/3 of that of DIP8.