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Pick-and-Place and Bonding Technology
Pick-and-Place and Bonding Technology
Description

This high-tech machine is designed for advanced pick-and-place and bonding technology. It supports chip mount with the minimum size of 0201 and IC mount with fine pitch in 0.3mm of QFP. The BGA or micro BGA has a diameter of 0.4mm with a 0.8mm pitch or a diameter of 0.3mm ball with 0.5mm pitch CSP.

  • Flip Chip Bonding: ACF, C4 and C5 Technology.
  • Aluminum wire bonding.
Surface Mount Technology Ltd

Surface Mount Technology Ltd

Hong Kong

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SUPPLIER INFO LAST UPDATED: 29 Sep 2020

ADVERTISE SINCE: 30 Nov 2006

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