Customs and Excise Department - The Government of the HKSAR

 List of HKAEOs 3M Hong Kong LimitedAG Logistics (Hong Kong) Company LimitedAPL Logistics SCS Hong Kong LimitedArrow Electronics China LimitedArrow/Components Agent LimitedArvato Services Hong Kong Ltd.Asia Airfreight Terminal Company LimitedAvery Dennison (Hong Kong) LimitedAvery Dennison Hong Kong B.V.Avnet Sunrise LimitedBausch &amp; Lomb (Hong Kong) LimitedBrink's Hong Kong LimitedC &amp; C Security Printing Company LimitedCamex Jewellery LimitedCanon Hongkong Company LimitedCEVA Logistics (Hong Kong) LimitedCheong Hing Store LimitedDCH Auriga (Hong Kong) LimitedDHL Global Forwarding (Hong Kong) LimitedDionex China LimitedDKSH Hong Kong LimitedDSV AIR &amp; SEA LIMITEDElegance Jewellery International LimitedEPSON HONG KONG LIMITEDEssence Metal (Asia) Company LimitedEXPEDITORS HONG KONG LIMITEDFederal Express (Hong Kong) LimitedFeiliks Logistics (Asia) LimitedFlexport Asia LimitedFortune Pharmacal Company, LimitedFujifilm Business Innovation Hong Kong LimitedGEODIS Hong Kong LimitedGordon Veni Jewelry Mfr. LimitedGosonic Logistic LimitedHankyu Hanshin Express (HK) LimitedHawley and Hazel Asia Investment Company LimitedHong Kong Cingleot Investment Management LimitedHong Kong Taiyo Yuden Company LimitedHONGKONG YUNEXPRESS LOGISTICS LIMITEDHonor Information Technology Co., LimitedHuawei International Co. LimitedHuawei Tech. Investment Co., LimitedHutchison Logistics (HK) LimitedIBM China/Hong Kong LimitedKerry Freight (Hong Kong) LimitedL'OREAL HONG KONG LIMITEDLee Fung Metal Company LimitedLee Kee International LimitedLee Kee Metal Company LimitedLee Kum Kee (Hong Kong) Foods LimitedLee Kum Kee (International) Trading LimitedLee Kum Kee International Holdings LimitedLife Technologies LimitedLOGWIN AIR &amp; OCEAN HONG KONG LIMITEDLX Pantos Logistics (Hong Kong) Co., LimitedMainetti (Eastern China) LimitedMainetti Packaging China LimitedMan King Industries Company LimitedMOL Logistics (H.K.) LimitedMolex Hong Kong/China LimitedMurata Company LimitedNelson Jewellery Arts Co. LimitedNexperia Hong Kong LimitedNitto Denko (HK) Co., Ltd.NNR Global Logistics (HK) LimitedOn Time Express LimitedPanasonic Hong Kong Co., LimitedPaxar (China) LimitedRichemont Asia Pacific LimitedRoche Hong Kong LimitedRoyale International Couriers LimitedSamsung Electronics H.K. Company, LimitedSea-Air Logistics (Hong Kong) LimitedSiemens LimitedSimmons Bedding &amp; Furniture (HK) LimitedSony Corporation of Hong Kong LimitedTDK Hongkong Company LimitedTE Connectivity HK LimitedThe Janel Group of Hong Kong LimitedThe Sharper Edge LimitedThermo Fisher Scientific (Hong Kong) LimitedTradeport Hong Kong LimitedTTM Technologies Trading (Asia) Company LimitedUPS Parcel Delivery Service LimitedVita Green Health Products Company LimitedVita Green Pharmaceutical (H.K.) LimitedWilson Logistics LimitedYEL Electronics Hong Kong LimitedYouthful Technology International Limited

List of Hong Kong AEOs

Shenzhen Xin Zesen Printing Co.,L td.

We have 12 professional designers and engineers. According to customer`s requirements, we design fashionable and useful structures for different products, especially for consumer electronics packaging and gift box.

Packaging Structure Design Service

SHENZHEN JUSTTIDE TRADING CO LTD

 Welcome to find us for customized jewelry！12＋years' experience in jewelry manufacturing.The production processcan be adjusted accordingto the budget.The most favorableprice,no intermediary price difference.Quality problems, uncon-ditional free reissue.Our main material is stainless steel.Alloy, Copper, pearl，Zirconia and so on can also be provided according to your design.Can provide beautifully photographed display images of your finished product.One-stop service, any problem, we are at your service 24 hours a day!

Custom Jewelry Manufacturers Design Logo

Guangzhou GRG Metrology And Test Technology Co., Ltd.

 The company is providing various chemical analysis and tests for raw materials and finished products. We are offering toy testing services too. Items we test include soluble heavy metals (Pb, Cd, Cr, As, Ba, Hg, Se, Sb), total Pb, phthalic acid salts and other organic compounds. 
 
  Testing standards: GB 6675-2003, EN 71-3 &amp; 9-11, ASTM F963, such as ISO 8124-3. 
  Battery directive testing items: lead (Pb), mercury (Hg), cadmium (Cd); testing standards: EPA 3050B, EPA, 3052, EPA 6010B, etc. 
  Packaging directive testing items: lead (Pb), mercury (Hg), cadmium (Cd), hexavalent chromium (Cr6 +); testing standards: EPA 3050B, EPA, 3052, EPA 6010B, etc. 
  Products testing: car air, total volatile organic compounds automotive components, ELV directive testing standards: EPA 3050B, EPA, 3052, EPA 6010B, HJ / T 400-2007, etc. 
  Material analysis and metal component analysis (component analysis of various metal grades). 
  Non-metallic (plastic, rubber, etc) component analysis (IR, DSC and TG). 
  Halogen-free testing; testing items: (F-, Cl-, Br-, I -, etc.); testing standards: BS EN 14582:2007, etc. 
  Test for the toxic and harmful substances of electronic products; testing items include polychlorinated biphenyls (PCB), polychlorinated Chennai (PCN), organic compounds (Organic Tin Compounds) polycyclic aromatic hydrocarbons (PAHs), phthalates (Phthalate), asbestos, etc. Testing standards: EPA 3540C, EPA 8270D, etc. 
  &nbsp; 
  Test for textile, clothing, leather, cloth; testing items include formaldehyde, azo dyes, organic tin compounds, perfluorooctane sulfonate (PFOS); testing standards: GB / T 17592.1-1998, GB / T 20385-2006, GB 18401-2001, etc. 
 

Chemical Analysis Test

SHENZHEN CHIPPACKING TECHNOLOGY CO.LTD.

 This national patented IC package is a brand new package type developed by Shenzhen Chippacking Technology Co., Ltd. It brings benefits of energy saving and resource saving from the compact structure to the total industrial chain from the IC manufacturing to the final electronics devices. This IC package also improves the IC performance and the life of electronics devices. 
 
  Meets the electronics devices&rsquo; requirements of lighter and thinner. 
  Currently, some enterprises have used our Qipai8 to package their products, such as battery charger ICs, voice ICs, MCUs, operational amplifiers, power amplifiers, etc. 
  It owns the same shape as DIP8 and the area of it is only 1/3 of that of DIP8. 
 

IC Package

OEM Custom 18K Gold Stainless Steel Jewelry

Shenzhen ZLX Technology Co Ltd

We offer one-stop contract PCB assembly services. Our services include 1-to-12-layer PCB fabrication, PCB design, PCB layout, PCB manufacturing, PCB assembly, component sourcing, PCBA function test and design solution. All the PCBs are manufactured and assembled under strict supervision to deliver stable and reliable performance.
 
  Material: FR-1, FR-2, FR-4, CEM-1, CEM-3, high TG, FR4 halogen free. 
  Board thickness: 0.2-3.5mm. 
  Max panel size: 630 x 520mm. 
  Min. drilled hole size: 0.5mm. 
  Min. line width: 0.075mm (3mil). 
  Min. line spacing: 0.075mm (3mil). 
  Surface finish/treatment: HASL/HASL lead free, chemical tin, chemical gold, immersion gold, immersion silver/gold, OSP, gold plating. 
  Copper thickness: 0.5oz min, 5oz max. 
  Solder mask color: green, black, white, red, blue and yellow. 
  Inner packing: vacuum packing and plastic bag. 
  Outer packing: standard carton packing. 
  Hole tolerance: PTH: &plusmn;0.076, NTPH: &plusmn;0.05. 
  Certificate: UL, ISO9001, ISO14001, ISO/TS16949 and RoHS. 
  Profiling punching: routing, V-cut and beveling. 
  OEM services only. 
 

Contract Electronic Manufacturing

We offer one-stop contract PCB assembly services. Our services include 1-to-12-layer PCB fabrication, PCB design, PCB layout, PCB manufacturing, PCB assembly, component sourcing, PCBA function test and design solution. All the PCBs come with a 1-year warranty.
 
  Material: FR-1, FR-2, FR-4, CEM-1, CEM-3, high TG, FR4 halogen free. 
  Board thickness: 0.2-3.5mm. 
  Max panel size: 630 x 520mm. 
  Min. drilled hole size: 0.5mm. 
  Min. line width: 0.075mm (3mil). 
  Min. line spacing: 0.075mm (3mil). 
  Surface finish/treatment: HASL/HASL lead free, chemical tin, chemical gold, immersion gold, immersion silver/gold, OSP, gold plating. 
  Copper thickness: 0.5oz min, 5oz max. 
  Solder mask color: green, black, white, red, blue and yellow. 
  Inner packing: vacuum packing and plastic bag. 
  Outer packing: standard carton packing. 
  Hole tolerance: PTH: &plusmn;0.076, NTPH: &plusmn;0.05. 
  Certificate: UL, ISO9001, ISO14001, ISO/TS16949 and RoHS. 
  Profiling punching: routing, V-cut and beveling. 
  OEM services only. 
 

Contract Electronic Assembly

We offer one-stop PCB assembly services. Our services include 1-to-12-layer PCB fabrication, PCB design, PCB layout, PCB manufacturing, PCB assembly, component sourcing, PCBA function test and design solution. There are various finishes for customers to choose from, such as chemical tin, immersion silver/gold, OSP and gold plating.
 
  Material: FR-1, FR-2, FR-4, CEM-1, CEM-3, high TG, FR4 halogen free. 
  Board thickness: 0.2-3.5mm. 
  Max panel size: 630 x 520mm. 
  Min. drilled hole size: 0.5mm. 
  Min. line width: 0.075mm (3mil). 
  Min. line spacing: 0.075mm (3mil). 
  Surface finish/treatment: HASL/HASL lead free, chemical tin, chemical gold, immersion gold, immersion silver/gold, OSP, gold plating. 
  Copper thickness: 0.5oz min, 5oz max. 
  Solder mask color: green, black, white, red, blue and yellow. 
  Inner packing: vacuum packing and plastic bag. 
  Outer packing: standard carton packing. 
  Hole tolerance: PTH: &plusmn;0.076, NTPH: &plusmn;0.05. 
  Certificate: UL, ISO9001, ISO14001, ISO/TS16949 and RoHS. 
  Profiling punching: routing, V-cut and beveling. 
  OEM services only. 
 

Electronic Assembly Service

Shenzhen HTWY Technology Co., Ltd

H.C.C. Technology owns two production bases in Shenzhen and Zhuhai,&nbsp;  10 SMT production lines &nbsp; and&nbsp;10 DIP production lines. It has advanced manufacturing equipment, leading technical level and excellent management team to provide customers with high quality&nbsp;  SMT chip processing&nbsp;and&nbsp;DIP. Plug-in related&nbsp;PCBA foundry&nbsp;production services.  
 Go to the company&#39;s official website for details. 

PCBA (Printed Circuit Board Assembly)

Tiger Drylac Taicang Co Ltd

 This powder coating is specifically used for electronic appliances. It adds an aesthetic finish on products. It makes an essential process to enhance your product values. 
 
  Carton: 20kg standard or 2.5kg mini pack. 
  Specific gravity: 1.3-1.7g/cm3. 
  Theoretical coverage: 9.8-12.8m2 (at 60um). 
  Storage stability: 6 months (below 25 &deg;C).

 &nbsp; 
 

Powder Coating for Electronics

Kenling Electronics Co., Ltd.

PCBA/OEM/ODM manufacturing services:
*Components Procurement
*PCB Assembly (SMT + DIP + programming + testing)
&nbsp;Process Capability:
&nbsp;&middot;&nbsp;PCB Max Size : 400*310mm
&nbsp;&middot;&nbsp;PCB Min Size: 50*50mm
&nbsp;&middot;&nbsp;PCB Thickness: 0.4~6mm
&nbsp;&middot;&nbsp;Components Size: 0201-150mm
&nbsp;&middot;&nbsp;Min Lead Pitch: 0.3mm
&nbsp;&middot;&nbsp;Min BGA Ball Pitch: 0.4mm
&nbsp;&middot;&nbsp;Placement Precision: +/- 0.03mm
&nbsp;&middot;&nbsp;Lines: 8 x SMT Production Lines,&nbsp;
&nbsp; &nbsp; &nbsp; &nbsp; &nbsp;2 x DIP product and 2 assembly lines
&nbsp;&middot;&nbsp;Lead Time: 3 days after received all materials
*Plastic Moulding and Injection

Capability Overview:
*ISO 9001:2008 Certificated
*RoHS &amp; Lead-Free PCB Assembly
*Advanced FUJI SMT Machine
*Flexible&nbsp;Turnkey Service (Components Purchasing/SMT/DIP Assembly/Testing)
*Prototype Building, No MOQ
*Surface Mount, Through Hole, BGA, QFP, QFN
*Programming, AOI Inspection, Function Test
*Housing Assembly, Cable Assembly
*Fast Delivery&nbsp;

PCB Assembly with Components Purchasing/SMT/DIP Assembly/Testing 

Shijiazhuang Ourpcb Tech Limited

 NO   ITEM   Technical capabilities 
1 SMT Through Hole assembly
2 Single/double side SMT &nbsp;Single/double sides mixture assembly
3 Accuracy &lt;&plusmn;40,under the condition of 3
4 CPK &ge;1
5 Angle accuracy&nbsp; &lt;&plusmn;0.06&deg;
6 Components Size SMT 01005 to 100mm&times;80mm
7 Minimum width/space of QFP 0.15mm/0.3mm
8 Minimum diameter /space of BGA 0.2mm/0.35mm
9 Maximum part's highness 18mm
10 Maximum part's weight 30g
11 PCB Size 50mm&times;50mm~450mm&times;406mm
12 PCB Thickness 0.5mm~4.5mm
13 Placer speed 60000chips/hour
14 Turnkey Service PCB Design, Layout Design
PCB manufacturing
Component procuring
SMT assembling, THT assembling
Wire soldering, Enclosure assembling
AOI inspecting
Programming
Function Testing
Packing&amp;Shipping

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