Compass Technology Co., Ltd.
Hong Kong
Exporter, Manufacturer
金柏科技有限公司 (Compass) 成立於1997年6月,註冊資本為港幣5傯5千萬,香港公司佔地面積14000多平米,是香港生產世界級半導體物料的供應商,生產最尖端的高密度軟質基材,產品廣泛應用在半導體封裝技術層面上的TBGA/ CSP/ WLP系列、液晶顯示模塊、保安感應模塊的指模悉別元器件和電子紙、高速光纖通訊器件(模塊傳輸速率40Gb/s~600Gb/s)以至醫療設備的元器件如CT Sensor 和微機電系統模組(MEMS Modules)產品的醫學數碼影像處理器等。
除生產高密度軟質基材外,金柏科技再投資超過5仟萬港元在模組封裝設備上,可以提供一站式服務,能夠完成錶面組裝技術(SMT) 達01005、IC綁定制程如反扣焊接(Flip chip bonding),鍚球熱壓法的公差在2μm 內和焊錫凸塊(solder bump) 間距在40μm 內。
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Company Information
Nature of Business:
Exporter, Manufacturer
Major Markets:
Eastern Europe, Japan, Korea, Mainland China, North America, Scandinavia, Southeast Asia, Taiwan, Western Europe
Main Categories:
Parts, Components & Raw Materials
Number of Staff (HK):
201 - 500
Year of Establishment:
1997
Company Award/ Qualification
ISO 9007:2000
ISO 9001:2008
ISO 14000:2004
OHSAS 18001:2007
2003 Hong Kong Awards For Industry: Quality Grand Award
ISO 9001:2008
ISO 14000:2004
OHSAS 18001:2007
2003 Hong Kong Awards For Industry: Quality Grand Award
Contact
Contact Person:
Ms Jane Cheung
Position:
HR & Admin Manager
Office Address:
Unit 10, 5/F Chiaphua Ctr 12-14 Siu Lek Yuen Rd Sha Tin, New Territories, Hong Kong
Country/ Region:
Hong Kong
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