ShenZhen Zentel Memory Technology Co., Ltd.

我们自主设计的内存芯片，经过严格的封装和测试，广泛应用于嵌入式系统，在商业级与工业级领域有广泛应用。其中，商业级内存芯片主要应用于消费电子和网络通信（如机器人、智能音响及 Wi-Fi 设备等），而工业级内存芯片则专为更高要求的工业控制应用服务，尤其能够满足极低温环境下的可靠性要求，确保在极端使用条件下的稳定性和长寿命。 

DRAM CHIP

NINGBO ALLNICE ELECTRIC TECHNOLOGY CO.,LTD

CW0812C-A射频芯片是一款高功率射频放大器半导体芯片。它具有高增益、高输出功率和良好的线性度。该芯片采用镀金法兰封装，散热性能优异，广泛应用于射频传输、微波通信和雷达探测等射频功率放大应用场景。 核心定义及背景：CW0812C-A射频功率芯片是一款采用陶瓷基板和镀金法兰封装的固态射频放大器件。它具有高功率密度和优异的导热性能，适用于800~1200MHz频段的射频信号放大，可实现通信和微波射频系统中的信号功率放大，并可替代国内同类型进口射频芯片。 连接方式：镀金法兰底板采用焊接固定；射频引脚采用金线键合，外部引脚可通过焊接或压接组装。 主要技术特性 工作频率范围：800~1200MHz 耐温范围：-40℃ ~ +125℃ 封装类型：镀金法兰封装 特点：高射频增益、高功率输出、优异的散热性能、抗射频击穿 应用：射频功率放大 应用场景：微波通信发射机、脉冲雷达系统、射频信号源、无线射频发射设备、专用射频功率放大器模块 

RF Chip CW0812C-A

CW-01～CW-08系列射频功率芯片包含8款型号：CW-01、CW-02、CW-03、CW-04、CW-05、CW-06、CW-07和CW-08。它们是固态微波射频放大器半导体器件，具有高增益、高输出功率、良好的线性度和优异的散热性能。该系列芯片采用镀金法兰封装，可满足不同频段的射频功率放大需求，广泛应用于雷达、微波通信和射频发射系统。 核心定义及背景：CW-01至CW-08属于同一系列射频功率芯片。这8款芯片涵盖不同的工作频段和功率等级，采用导热性能优异的陶瓷基板和镀金法兰封装技术。它们可以放大微波射频系统中的信号功率，支持连续波和脉冲工作模式，并可替代同系列的进口射频功率芯片。 连接方式：镀金法兰底板焊接固定；内部金线键合，外部引脚可焊接组装。 主要技术特性 耐温范围：-40℃ ~ +125℃ 封装类型：镀金法兰封装 特点：高射频增益、高功率输出、优异的散热性能、抗射频击穿 工作模式：支持连续波/脉冲工作 型号区别：CW-01~CW-08 分别对应不同的频段和输出功率规格 应用场景：脉冲雷达系统、微波通信发射机、专用射频功率放大器模块、射频信号源、无线射频发射设备 

CW-01 ~ CW-08 Series RF Power Chips

内存KGD晶圆:我们主要为SoC厂商提供定制化内存KGD晶圆。在芯片设计阶段，我们针对客户需求进行精准的晶圆测试，并将合格的晶圆交付给下游厂商用于后续封装加工。通过与客户深度合作，我们的晶圆都符合客户的高标准技术要求。 

KGD wafers

茂林(香港)線路板有限公司

   錶仔板。   應用於心跳監察器及氣壓器產品。  

多層電子線路板

邁高達科技有限公司

◆ High-performance: ARM cortex-A17 Quad-core CPU+Mali-T76x GPU and 2GB DDRAM. Capable of playing 4K*2K UHD videos and handling complex interactive operations.
◆High Robustness: Can achieve 7*24 hours unattended.
◆High level of integration: Integrated with gigabit Ethernet, Wi-Fi, Bluetooth, 6W audio amplifier, TF card
reader, IR remote control, HDMI output, LVDS, eDP, microphone,etc. It is greatly simplify the design of
the whole machine.
◆High scalability: 5x USB ,3xSerial ports,2x I2Cports,6xGPIO

Microtech SMT PCBA Solution RK3288W CPU, 4x DDR3, 8G, 16G/32G/64G/128G Optional PCBA Board With LCD 

Microtech SMT PCBA Solution with RK3288W CPU and DDR3

Suzhou UIGreen Micro&Nano Technologies Co., Ltd.

RF high-speed test socket are specialized interface components designed for 5G communication chips, millimeter-wave radar chips, and high-speed interface chips (e.g., QFN/DFN flat-lead packages). . It adopts Z series contacts, and its core function is to enable low-loss, low-reflection signal transmission within specified frequency bands while ensuring mechanical connection stability and electrical performance consistency. 

RF High Frequency Test Socket

RF High Frequency Test Socket for 5G and radar chips

ABO ELECTRONICS (SHENZHEN) CO LTD

WIFI PCBA, customized PCB ASSEMBLY Service Scope ODM: Include Mechanical design, PCB Layout, Firmware development, APP development and OS development services. OEM: Include component sourcing and procurement, PCB Fabrication, PCB Assembly, Build of Box Assembly, Function Testing, Aging Testing, Packing and Logistic Services. DFM(Design For Manufacturing): Feed back customer of circuit layout optimization and component performance optimization requirements. DFP(Design For Purchasing): Recommend price competitive equivalent or better quality equivalent components. DFT(Design For Testing): Recommend price competitive testing solution for “high mix, low volume” projects or ATE(Auto-Testing-Equipment) solution for big volume projects.  Product Testing&amp; InspectionTest Development Services In-circuit Test Function Test Flying Probe Burn In &amp; Environment Stress Screening AOI Test Automated Test Platform Solutions X-Ray inspection PCBA ProductionLow Volume / High Mix Production High-Volume Production Customized Fulfillment Planning &amp; Options Total Quality ManagementISO 9001:2015Certified ISO 13485:2016Certified RoHS Compliant Compliant to IPC-A-610 Workmanship Standards UL, CE/FCC, CSAetcCertification Support Supply Chain ManagementDomestic &amp; International Sourcing Long-Term Collaborative Supplier Relationships Inventory Management Systems Strict Counterfeit Prevention Policy Kanban Manufacturing Programs 

GPS/WIFI/Bluetooth/Wireless PCBA

Fenghua (Hong Kong) Electronics Ltd.

Chip resistors are available in different resistance values, tolerance levels, and power ratings to accommodate various circuit requirements. The resistance values can range from a few ohms to several megaohms, providing flexibility for different applications. The tolerance level indicates the acceptable deviation from the specified resistance value, ensuring accurate and consistent performance. Common sizes of chip resistors include: 0402: This size measures 0.04 inches by 0.02 inches (1.0mm by 0.5mm) and is commonly used in compact electronic devices and densely populated circuit boards. 0603: These resistors have dimensions of 0.06 inches by 0.03 inches (1.6mm by 0.8mm) and are widely used in consumer electronics, telecommunications, and automotive applications. 0805: With measurements of 0.08 inches by 0.05 inches (2.0mm by 1.25mm), 0805 resistors are popular for their versatility and ease of handling. They are commonly found in a wide range of electronic circuits. 1206: These resistors measure 0.12 inches by 0.06 inches (3.2mm by 1.6mm) and are often used in various electronic applications that require higher power handling capabilities. 1210: With dimensions of 0.12 inches by 0.10 inches (3.2mm by 2.5mm), 1210 resistors offer larger power ratings and are suitable for applications that require higher power dissipation. These sizes represent some of the most commonly used chip resistor dimensions. However, there are many other sizes available to meet specific circuit requirements. It is essential to select the appropriate chip resistor size based on factors such as power requirements, board space, and thermal considerations. 

Chip Resistor (AEC-Q200)

Chip Resistor AEC Q200 for various circuit requirements

  LCD Module  Different Size Available  Used for MP3 player, Palm, Pocket PC, Mobile phone screen  

LCD Module

LCD Module for MP3 player, Palm, Pocket PC, Mobile phone

雙面電子線路板 

Dongguan Apollo Precision Electronic Co. Ltd.

The circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part directly contacts the heat dissipation part of the lamp bead to achieve the best heat dissipation (zero thermal resistance) effect. And the material of the substrate is generally the copper substrate.  

SinkPAD PCB

SinkPAD PCB for optimal heat dissipation in circuits.

The featured printed circuit board comes in a compact size and is excellent for wearable watches. It is made of FR-4 grade material and has a two-layer design. This printed circuit board has a flash gold plating finish and offers excellent connectivity. 	 Rigid printed circuit board (PCB). 	 Material: FR-4. 	 Layer: 2 layers. 	 Board thickness: 0.6mm. 	 Finishing: flash gold plating. 	 Solder mask: green color. 	 COB PCB. 	 Wire bonding PCB. 	 Wearable watch PCB. 	 Side push PCB. 	 Compact size. 	 Simple installation. 	 Excellent connectivity.  

Rigid PCB

Rigid PCB for wearable watches with excellent connectivity

Shenzhen Chengxing Electronic Technology Co., Ltd.

Chip Series Compact SMD LED, Small Package *High Brightness* Status Display 

CHIP LED

CHIP LED - Compact SMD LED with high brightness

RF Chip TrayRF Chip Tray is a special carrier for storing, transporting and packaging bare chips / RF die. It is made of anti-static material. It can protect precision RF chips from static electricity and collision damage during storage, picking and testing. The slots provide precise positioning, suitable for gold wire bonding and wafer back-end packaging processes. Core Definition &amp; BackgroundRF Chip Tray is a precision semiconductor carrier, specially used for storage and turnover of high-power RF bare chips and microwave die. It has excellent anti-static performance to discharge static electricity effectively. The tray has precision cavity size to hold chips stably and easy for tweezers picking. Widely used in semiconductor packaging and RF device production lines to protect high-value RF chips. Connection Method: Chips are placed in the cavity grooves of the tray; the whole tray is stored in an anti-static storage box. Key Technical CharacteristicsTemperature Resistance Range: -40℃ ~ +125℃Material: Anti-static engineering plasticAnti-static Performance: Controllable surface resistance, effective static protectionCavity Precision: High-precision cavity, stable chip positioningFeatures: Anti-collision, anti-static, easy manual picking, reusable Application Scenarios: Storage of bare RF chips, transportation of microwave semiconductor chips, semiconductor packaging workshop, chip test station, turnover of high-power RF die根据订单数量评估生产周期 

RF Chip Tray

RF Chip Tray for storing and transporting RF bare chips

   無卥素。   應用於摩打產品。  

Chengdu sinochips technology Co.,Ltd

Standard electronic components

愛科通有限公司

We offer a full suite of integrated electronics manufacturing services from printed-circuit board (PCB) assembly to original equipment manufacturers (OEMs) including design support, procurement, assembly, final system build, test, and packaging. 

PCB Assembly

PCB Assembly with integrated electronics manufacturing services

Changsha Software Park Developmeng Center

This Beidou-2 navigation baseband chip comes with a compact design. It is professionally engineered to provide reliable performance. This baseband chip is manufactured under strict QC to promise quality you can rely on.
 
  Beidou-2 navigation baseband chip. 
  Low voltage. 
  Compact design. 
 

Baseband Chip

珠海歐比特控制工程股份有限公司

  This integrated circuit is delicately designed and made into the universal square shape. The top-quality metal trim allows easy installation. This component is an excellent choice for making electronic products such as computers and mobile phones.    
 
   Powerful and functional.    
   Extra-long serving time.  
 

Integrated Circuit

Integrated Circuit designed for computers and mobile phones

Shenzhen Taishan Online Technology Co., Ltd.

 This IC chip features a specially designed compressor for excellent performance. This IC chip comes with a robust structure. This IC chip is applied in different fields, such as the smart TV, set-top box, motion sensing sports game and so on.    Robust design.   Solution plans for human computer interaction.   Artificial intelligence.  

IC Chip

IC chip with robust design for various applications

Trutag Technologies Inc

Micro Chip on Tweezers

Maxgtech

Sturdy attachment of semiconductor devices and other substrate components to this durable microchip body makes your miniaturized electronic circuit extra durable. Made as a direct replacement to discrete circuits, these integrated circuits are more cost-effective and reliable than the former.   Durable and convenient.   Secured attachment to other electrical circuit components.  

Integrated Circuit for durable and reliable electronic circuits

Changzhou Qiuhui Co., Ltd

This is an integrated circuit made in square shape. It comes with a thin thickness in quality materials. The high quality IC chip is available with different capacity according to the types of electronics. 
    Other modules and size are available  High durability  Quality products at competitive prices  

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