Guangzhou Tianxin Photoelectric Co., Ltd.
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聯絡供應商
描述
Products’ Features:
1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance
projection illumination
2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity
between LEDs and MCPCB substrate
3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to enable longer lifespan
4, Average efficiency upto 40lm/W @Tj=85℃ with full power
1, Small LES, 5W/mm² , High Power and high light density for spot lighting,far distance
projection illumination
2, The latest Eutectic Flip-chip bonding with Cree Chips, Thermoelectric solution, fast heat-conductivity
between LEDs and MCPCB substrate
3, Unique Parallel and Serial connection of LED design, Lower Forward Current result in Lower heat-emission to enable longer lifespan
4, Average efficiency upto 40lm/W @Tj=85℃ with full power
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