Xiamen Bolion Tech Co., Ltd.
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4 Layers with Enig Surface Treatment Rigid-Flex PCB
產品型號:
R9442
品牌名稱:
BOLION
尺寸:
30 X 23.5mm
港口:
XIAMEN
付款方式:
T/T, L/C
最低訂購數量:
1
是否有包裝:
有
是否可訂造:
是
板厚:
0.5mm
最小線距:
0.2mm
最小線寬:
0.2mm
基板材質:
copper
銅厚:
0.3mm
表面處理:
Immersion Gold
鍍通孔種類:
鍍通孔印製電路板
描述
聯絡供應商
描述
R9442
For Medical Device
Layers: 4
Materials: 1.4-mil CU/0.8-mil ADH/1-mil PI double-sided electrolytic copper, 0.3mm copper
Cover layer: 1-mil ADH/1-mil PI
Stiffener: Prepreg
Thickness: 0.5mm
Surface treatment: ENIG, (Au:0.03 to 0.09um, Ni: 3 to 9um)
Dimensions: 30 x 23.5mm
Width/space: 0.2/0.2mm
For Medical Device
Layers: 4
Materials: 1.4-mil CU/0.8-mil ADH/1-mil PI double-sided electrolytic copper, 0.3mm copper
Cover layer: 1-mil ADH/1-mil PI
Stiffener: Prepreg
Thickness: 0.5mm
Surface treatment: ENIG, (Au:0.03 to 0.09um, Ni: 3 to 9um)
Dimensions: 30 x 23.5mm
Width/space: 0.2/0.2mm
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