Featured is a high speed inspection wafer bump inspection equipment. This equipment is the automatic X-ray equipment that provides void detection of solder bump. The precise and professional design guarantees reliable performance.

• This equipment is the automatic X-ray equipment which provides void detection of solder bump. 
• It penetrates by using void (bubble) in the wafer and using X-rays, and the automatic judgment inspection.
• Quality of void more than a standard value.
• Done from the transfer imaging for the diameter of void (area).