Shenzhen Flying Technology Co Ltd
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Hdi Multi-Layer PCB Circuit Board
基板材質:
FR-4
銅厚:
18-70um
層數:
4-24
最小孔徑:
6mil, 4mil
表面處理:
HASL
板厚:
0.4-3.0mm
描述
聯絡供應商
描述
- Number of Layers: 4-24 layers
- Order quantity: 1-10000+pcs
- Material: FR-4 and Roger
- Board thickness: 0.4-3.0mm
- Copper Weight: 18-70um
- Min drilling hole diameter: 6mil(0.15mm),4mil(0.10mm)-laser drill
- Surface finish: HASL
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