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Heat-Shrink Solderable Butts
產品型號:
TM-HS-SB
描述
聯絡供應商
描述
Material:
(insulation) heat-shrinkable polyolefin, (solder) lead-free tin, (rings) meltable thermally stabilized thermoplastic.
Solder melting temp: 138℃, flux activated rosin
Work temp: -55℃ TO +125℃
Shrinking temp: >200℃
Dielectric strength: 2Kv
Protection type: IP 67
(insulation) heat-shrinkable polyolefin, (solder) lead-free tin, (rings) meltable thermally stabilized thermoplastic.
Solder melting temp: 138℃, flux activated rosin
Work temp: -55℃ TO +125℃
Shrinking temp: >200℃
Dielectric strength: 2Kv
Protection type: IP 67
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