力創（台山）電子科技有限公司
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描述
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描述
- Specification:Sn-0.7Cu
- Melting Point:227℃
- Working Temperature:260-300℃
- Relatively low melting point
- Good fluidity
- Good oxidation resistance ability
- Good thermal fatigue resistance
- Lower tin slag
- High reliability
- Highlighted here is a lead-free solder bar for commercial use.
- It may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free replacements for conventional Sn60/Pb40 and Sn63/Pb37 soldering have melting points from 5 to 20°C or higher, though solder bars with much lower melting points are available.
- This lead free solder bar is suitable for wave soldering and manual soldering. It has low melting point, low using temperature, strong anti-oxidation property, good solder ability and thermal fatigue resistance. The surface of solder joints is bright and allows soldering with a glazed surface.
- Solder bar for commercial use.
- May contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals
- Suitable for wave soldering and manual soldering.
- Low melting point, low using temperature, strong anti-oxidation property, good solder ability and thermal fatigue resistance.
- Sn Cuseries and Snpb series solder performance comparison.
- Composition (wt%) Sn/Cu0.7 Sb63/Pb37.
- Melting point℃ 227 183.
- Density (25℃) 7.4 8.4.
- Hot melt (J/KG.K) 220 176.
- Thermal conductivity (j/m.s.k) 64 50.
- Tensile strength (Mpa) 32 44.
- Ductility (%)df 48 25.
- Resistivity (Ωm) 0.13 0.17.
- Coverage (%).
- 230℃ 91.
- 240℃ 77 92.
- 250℃ 77 93.
- 260℃ 77 93.
- 280℃ 78.
- Wetting balance test Ta Tb Fmax Ta Tb Fmax.
- 20kg/box.
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