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Multilayer PCB with Immersion Tin Finish, Manufacturing Standard: IPC-A-600F and PERFAG
描述
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描述
- Double-sides and multilayer (up to 16-Layer)
- Base material: FR-4, CEM-3, Teflon, Aluminum Substrate, Roger
- Surface Finish: HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, Entek, Preflux, Heat Sink, Gold Finger Plating, Carbon Ink Printingm Peelable Blue Mask (peters2954)
- Solder Mask: Taito PSR 4000, Taimura DS2200, Electra (Dull Green)
- Technology: Blind Vias, Buried Visa, Micro Visa, Selective Plating, HDL, Leadfree
- Maximum Panel Size: 20〃 x 24〃 (508 x 610mm)
- Minimum Hole Diameter 0.008〃 (0.2mm)
- Finished Hole Tolerance: ∮0.002〃 (∮0.05mm)
- Minimum Line Width / Spacing: 0.004〃/ 0.004" (0.10/0.10mm)
- Board Thickness: 0.016〃 (0.40mm) for 4-Layer, 0.020〃 (0.60mm) for 6-Layer
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